sales@aipcba.com
CN
电子元器件采购 > 开发板 > TI >

TMDXEVM6670LXE 库存 & 价格

TI MCU, MPU & DSP Development Tools TMS320C6670 Eval Mod
1412.03
TMDXEVM6670LXE
显示的图像仅供参考,应从产品数据表中获得准确的规格。
TMDXEVM6670LXE TI
TI
  • 制造商:
    TI
  • 制造商型号#:
    TMDXEVM6670LXE
  • 百芯编号#:
    CM146857386
  • 价格(CNY):
    1412.03
  • 百芯库存:
    135,727
  • 库存地点: 香港
  • 可供应量:
    139,281 个在库
    此为供应商库存,需要与销售确认
  • 产品类别:
    开发板
  • 产品描述:
    MCU, MPU & DSP Development Tools TMS320C6670 Eval Mod
  • 文档: 3D模型
TMDXEVM6670LXE 购买 TMDXEVM6670LXE 库存和价格更新于 2025-06-15 03:50:22
  • 刷新
    器件型号: TMDXEVM6670LXE
    百芯编号: CM146857386
    制造商: TI
    价格
    1412.03
    总计: 275,008
    MOQ: 1
    库存地点: 香港
    发货日期: 2025/06/20 (预期 )
  • 购买
    *由于库存数量、价格不断波动,请 联系我们 获取型号最新价格和库存。

    元器件库存查询

    库存查询
    百芯库存涵盖100,000个元器件
    欺诈预防提醒
    近日,我们发现不法分子冒充百芯智造进行诈骗或试图低价销售假冒和故障元器件。
    百芯智造在2021年建立了一个 元器件检测实验室 ,旨在提供有质量保证的组件。
    我们强烈建议客户选择可靠的元器件供应商。
    请注意,唯一电子邮件后缀是 aipcba.com
    TMDXEVM6670LXE 规格 显示相似产品 (99+)
    类型
    描述
    选择
    制造商
    TI
    类别
    开发板
    3D模型
     3D模型
    显示相似产品
    TMDXEVM6670LXE 数据规格书
    TMDXEVM6670LXE 数据手册Datasheet
    206 Pages, 2623 KB
    2012/03/29
    查看
    尺寸 & 包装
    类型
    描述
    产品生命周期
    Unknown
    符合标准
    类型
    描述
    RoHS标准
    Non-Compliant
    含铅标准
    Lead Free
    出口分类
    类型
    描述
    ECCN代码
    5A002
    产品概述
    • TMDSEVM6670L | TMDSEVM6670LE | TMDSEVM6670LXE
    • **TMDSEVM6670L** \\- TMS320C6670 Lite Evaluation Module
    • The TMS320C6670 Lite Evaluation Module (EVM), or TMDSEVM6670L, is an easy-to-use, cost-efficient development tool that is designed to help developers quickly get started with designs using the C6670 multicore DSP. It includes an on-board, single C6670 processor with robust connectivity options that allows customers to use an AMC form factor card in various systems. It also works as a stand alone board.
    • The TMDSEVM6670L EVM comes with XDS100 embedded emulation capability. In addition, an external emulator via JTAG emulation header can be also be used. Software accompanying the 6670L EVM includes Code Composer Studio Studio™ version 4.2 (CSv4.2), Board Support Package (BSP), Chip Support Library (CSL), Power On Self Test (POST), Network Development Kit (NDK), and Out of Box (OOB) Demonstration SW.
    • The TMDSEVM6670L EVM is designed for an ease of use environment to evaluate the features & functions of the multicore C6670 DSP. The emulation capability and software included in the EVM will allow customer to program the C6670 DSP to benchmark the algorithms that are intended to be implemented on C6670 DSP.
    • **TMDSEVM6670LE** \\- TMS320C6670 Lite Evaluation Module with XDS560V2 Emulation
    • The TMDSEVM6670LE Lite Evaluation Module (EVM) is an easy-to-use, cost-efficient development tool that is designed to help developers quickly get started with designs using the C6670 multicore DSP. It includes an on-board, single C6670 processor with robust connectivity options that allows customers to use this AMC form factor card in various systems. It also works as a stand alone board.
    • The TMDSEVM6670LE EVM comes with XDS560V2 embedded emulation capability. The software accompanying the 6670LE EVM includes Code Composer Studio Studio™ version 4.2 (CSv4.2), Board Support Package (BSP), Chip Support Library (CSL), Power On Self Test (POST), Network Development Kit (NDK), and Out of Box (OOB) Demonstration SW.
    • The TMDSEVM6670LE EVM is designed for an ease of use environment to evaluate the features & functions of the C6670 multicore DSP. The emulation capability and software included in the EVM will allow customer to program the C6670 DSP to benchmark the algorithms that are intended to be implemented on C6670 DSP.
    • **NOTE:** The TMDSEVM6670LE is expected to be available in September 2011.
    • **TMDSEVM6670LXE** \\- TMS320C6670 Lite Evaluation Module with Encryption and XDS560V2
    • The TMDSEVM6670LXE Lite Evaluation Module (EVM) is an easy-to-use, cost-efficient development tool that is designed to help developers quickly get started with designs using the C6670 multicore DSP. It includes an on-board, single C6670 processor with robust connectivity options that allows customers to use this AMC form factor card in various systems. It also works as a stand alone board.
    • The TMDSEVM6670LXE EVM has*encryption enabled** and comes with **XDS560V2 embedded emulation capability**. The software accompanying the 6670LE EVM includes Code Composer Studio Studio™ version 4.2 (CSv4.2), Board Support Package (BSP), Chip Support Library (CSL), Power On Self Test (POST), Network Development Kit (NDK), and Out of Box (OOB) Demonstration SW.
    • The TMDSVM6670LXE EVM is designed for an ease of use environment to evaluate the features & functions of the multicore C6670 DSP. The emulation capability and software included in the EVM will allow customer to program the C6670 DSP to benchmark the algorithms that are intended to be implemented on C6670 DSP.
    • **NOTE:** Please contact your **local TI sales representative** to request the TMDSEVM6670LXE.

    百芯智造认证

    百芯智造承诺产品质量和安全通过ISO 9001、ISO 13485、ISO 45001、UL、RoHS、CQC 和 REACH 认证
    查看我们的认证 >
    订购详情及相关信息
    •  此处条款仅供参考,实际条款以销售报价为准。
      - 订购时请确认产品规格。
      - MOQ 是指购买每个零件所需的最小起订量。
      - 如果您有特殊的订购说明,请在订购页面注明。
      - 装运前会进行检验 (PSI)。
      - 您可以随时给我们发邮件查询订单状态。
      - 包裹发货后无法取消订单。
    • - 提前电汇(银行转账),也可选择PayPal。
      - 仅限现金转账。(不接受支票和账单转账。)
      - 客户负责支付所有可能的费用,包括销售税、增值税和海关费用等。
      - 如果您需要详细的发票或税号,请给我们发送电子邮件。
    • - 可选择顺丰或跑腿。
      - 您可以选择是通过您的运费帐户收取运费还是由我们收取。
      - 偏远地区请提前与物流公司确认。
      (在这些地区送货可能会收取额外费用(35-50 美元)。)
      - 交货日期:通常为 2 到 7 个工作日。
      - 您的订单发货后将发送跟踪号。
    • - 由百芯智造仓库仔细检查和包装
      - 真空包装
      - 防静电包装
      - 防震泡沫
    • - 收入质量控制 (IQC),800多家合格经销商。
      - 500m² 高级元器件检测实验室、假冒检测、RoHS 合规性等
      - 2000㎡数码元器件仓库,恒温恒湿
      - 开盖检查
      - X-Ray检查
      - XRF检查
      - 电气测试
      - 外观检测
    • - 不合格和假冒检测
      - 故障分析
      - 电气测试
      - 生命周期和可靠性测试
      -百芯2021年成立元器件检测实验室
      了解更多 >

    电子元件供应服务

    立即查看
    SN:H0.67222LO0V8Q0QC0S1
    在线联系我们
    黄经理 - 百芯智造销售经理在线,5 分钟前
    您的邮箱 *
    消息 *
    发送