sales@aipcba.com
CN
电子元器件采购 > 微控制器,MCU,单片机 > TI >

SM470R1B1MHFQS 库存 & 价格

SM470R1B1MHFQS
显示的图像仅供参考,应从产品数据表中获得准确的规格。
SM470R1B1MHFQS TI
库存紧缺
TI
  • 制造商:
    TI
  • 制造商型号#:
    SM470R1B1MHFQS
  • 百芯编号#:
    CM100745176
  • 价格(CNY): ¥ 4779.32
  • 百芯库存:
    5
  • 库存地点: 香港
  • 可供应量:
    17 个在库
    此为供应商库存,需要与销售确认
  • 产品类别:
    微控制器,MCU,单片机
  • 产品描述:
    MCU 16Bit/32Bit ARM7TDMI RISC 1024KB Flash 3V 84Pin CFPAK Tube
  • 文档: 3D模型
SM470R1B1MHFQS 购买 SM470R1B1MHFQS 库存和价格更新于 2024-05-31 03:50:22
  • 刷新
    器件型号: SM470R1B1MHFQS
    百芯编号: CM100745176
    制造商: TI
    价格 ¥4779.32
    总计: 22
    MOQ: 1
    库存地点: 香港
    发货日期: 2024/06/05 (预期 )
  • 购买
    *由于库存数量、价格不断波动,请 联系我们 获取型号最新价格和库存。

    元器件库存查询

    库存查询
    百芯库存涵盖200,000个元器件
    欺诈预防提醒
    近日,我们发现不法分子冒充百芯智造进行诈骗或试图低价销售假冒和故障元器件。
    百芯智造在2021年建立了一个 元器件检测实验室 ,旨在提供有质量保证的组件。
    我们强烈建议客户选择可靠的元器件供应商。
    请注意,唯一电子邮件后缀是 aipcba.com
    SM470R1B1MHFQS 规格 显示相似产品 (99+)
    类型
    描述
    选择
    制造商
    TI
    类别
    微控制器,MCU,单片机
    3D模型
     3D模型
    安装方式
    Surface Mount
    引脚数
    84 Pin
    封装
    CFP-84
    频率
    60 MHz
    RAM大小
    64 KB
    FLASH内存容量
    1048576 B
    模数转换数(ADC)
    1 ADC
    工作温度(Max)
    220 ℃
    工作温度(Min)
    -55 ℃
    电源电压(Max)
    2.05 V
    电源电压(Min)
    1.81 V
    显示相似产品
    SM470R1B1MHFQS 数据规格书
    SM470R1B1MHFQS 数据手册Datasheet
    79 Pages, 799 KB
    查看
    SM470R1B1MHFQS 产品设计参考
    114 Pages, 755 KB
    2005/06/29
    查看
    尺寸 & 包装
    类型
    描述
    长度
    13.8 mm
    宽度
    13.8 mm
    高度
    2.67 mm
    工作温度
    -55℃ ~ 220℃
    产品生命周期
    Active
    包装方式
    Tube
    符合标准
    类型
    描述
    RoHS标准
    Non-Compliant
    含铅标准
    Contains Lead
    出口分类
    类型
    描述
    ECCN代码
    3A001A2A
    产品概述
    • The SM470R1B1M(3) devices are members of the Texas Instruments SM470R1x family of general-purpose 16-/32-bit reduced instruction set computer (RISC) microcontrollers. The B1M microcontroller offers high performance using the high-speed ARM7TDMI 16-/32-bit RISC central processing unit (CPU), resulting in a high instruction throughput while maintaining greater code efficiency. The ARM7TDMI 16-/32-bit RISC CPU views memory as a linear collection of bytes numbered upwards from zero. The SM470R1B1M uses the big-endian format where the most significant byte of a word is stored at the lowest numbered byte and the least significant byte of a word is stored at the highest numbered byte.
    • High-end embedded control applications demand more performance from their controllers while maintaining low costs. The B1M RISC core architecture offers solutions to these performance and cost demands while maintaining low power consumption.
    • The B1M devices contain the following:
    • The functions performed by the 470+ system module (SYS) include:
    • The enhanced RTI module on the B1M has the option to be driven by the oscillator clock. The DWD is a 25-bit resettable decrementing counter that provides a system reset when the watchdog counter expires. This data sheet includes device-specific information such as memory and peripheral select assignment, interrupt priority, and a device memory map. For a more detailed functional description of the SYS module, see the _TMS470R1x System Module Reference Guide_ (SPNU189).
    • The B1M memory includes general-purpose SRAM supporting single-cycle read/write accesses in byte, half-word, and word modes.
    • The flash memory on this device is a nonvolatile, electrically erasable, and programmable memory implemented with a 32-bit-wide data bus interface. The flash operates with a system clock frequency of up to 24 MHz or 30 MHz, depending on the input voltage. When in pipeline mode, the flash operates with a system clock frequency of up to 48 MHz or 60 MHz, depending on the input voltage. For more detailed information on the flash, see 8.2.1.4.
    • The MSM and the JTAG security module prevent unauthorized access and visibility to on-chip memory, thereby preventing reverse engineering or manipulation of proprietary code.
    • The B1M device has twelve communication interfaces: two SPIs, three SCIs, two HECCs, and five I2Cs. The SPI provides a convenient method of serial interaction for high-speed communications between similar shift-register type devices. The SCI is a full-duplex, serial I/O interface intended for asynchronous communication between the CPU and other peripherals using the standard non-return-to-zero (NRZ) format. The HECC uses a serial, multimaster communication protocol that efficiently supports distributed realtime control with robust communication rates of up to 1 Mbps. These CAN peripherals are ideal for applications operating in noisy and harsh environments (for example, industrial fields) that require reliable serial communication or multiplexed wiring. The I2C module is a multimaster communication module providing an interface between the B1M microcontroller and an I2C-compatible device through the I2C serial bus. The I2C supports both 100 Kbps and 400 Kbps speeds. For more detailed functional information on the SPI, SCI, and CAN peripherals, see the specific reference guides (SPNU195, SPNU196, and SPNU197). For more detailed functional information on the I2C, see the _TMS470R1x Inter- Integrated Circuit (I2C) Reference Guide_ (SPNU223).
    • The HET is an advanced intelligent timer that provides sophisticated timing functions for realtime applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The HET can be used for compare, capture, or general-purpose I/O. It is especially well-suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. The HET used in this device is the high-end timer lite. It has fewer I/Os than the usual 32 in a standard HET. For more detailed functional information on the HET, see the _TMS470R1x High-End Timer (HET) Reference Guide_ (SPNU199).
    • The B1M HET peripheral contains the XOR-share feature. This feature allows two adjacent HET high-resolution channels to be XORed together, making it possible to output smaller pulses than a standard HET. For more detailed information on the HET XOR-share feature, see the _TMS470R1x High-End Timer (HET) Reference Guide_ (SPNU199).
    • The B1M device has one 10-bit-resolution, sample-and-hold MibADC. Each of the MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. There are three separate groupings, two of which can be triggered by an external event. Each sequence can be converted once when triggered or configured for continuous conversion mode. For more detailed functional information on the MibADC, see the _TMS470R1x Multi-Buffered Analog-to-Digital Converter (MibADC) Reference Guide_ (SPNU206).
    • The ZPLL clock module contains a phase-locked loop, a clock-monitor circuit, a clock-enable circuit, and a prescaler (with prescale values of 1 to 8). The function of the ZPLL is to multiply the external frequency reference to a higher frequency for internal use. The ZPLL provides ACLK to the system (SYS) module. The SYS module subsequently provides system clock (SYSCLK), realtime interrupt clock (RTICLK), CPU clock (MCLK), and peripheral interface clock (ICLK) to all other B1M device modules. For more detailed functional information on the ZPLL, see the _TMS470R1x Zero-Pin Phase-Locked Loop (ZPLL) Clock Module Reference Guide_ (SPNU212).
    • ACLK should not be confused with the MibADC internal clock, ADCLK. ACLK is the continuous system clock from an external resonator/crystal reference.
    • The EBM is a standalone module that supports the multiplexing of the GIO functions and the expansion bus interface. For more information on the EBM, see the _TMS470R1x Expansion Bus Module (EBM) Reference Guide_ (SPNU222).
    • The B1M device also has an external clock prescaler (ECP) module that when enabled, outputs a continuous external clock (ECLK) on a specified GIO pin. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (ICLK) frequency. For more detailed functional information on the ECP, see the _TMS470R1x External Clock Prescaler (ECP) Reference Guide_ (SPNU202).

    百芯智造认证

    百芯智造承诺产品质量和安全通过ISO 9001、ISO 13485、ISO 45001、UL、RoHS、CQC 和 REACH 认证
    查看我们的认证 >
    订购详情及相关信息
    •  此处条款仅供参考,实际条款以销售报价为准。
      - 订购时请确认产品规格。
      - MOQ 是指购买每个零件所需的最小起订量。
      - 如果您有特殊的订购说明,请在订购页面注明。
      - 装运前会进行检验 (PSI)。
      - 您可以随时给我们发邮件查询订单状态。
      - 包裹发货后无法取消订单。
    • - 提前电汇(银行转账),也可选择PayPal。
      - 仅限现金转账。(不接受支票和账单转账。)
      - 客户负责支付所有可能的费用,包括销售税、增值税和海关费用等。
      - 如果您需要详细的发票或税号,请给我们发送电子邮件。
    • - 可选择顺丰或跑腿。
      - 您可以选择是通过您的运费帐户收取运费还是由我们收取。
      - 偏远地区请提前与物流公司确认。
      (在这些地区送货可能会收取额外费用(35-50 美元)。)
      - 交货日期:通常为 2 到 7 个工作日。
      - 您的订单发货后将发送跟踪号。
    • - 由百芯智造仓库仔细检查和包装
      - 真空包装
      - 防静电包装
      - 防震泡沫
    • - 收入质量控制 (IQC),800多家合格经销商。
      - 500m² 高级元器件检测实验室、假冒检测、RoHS 合规性等
      - 2000㎡数码元器件仓库,恒温恒湿
      - 开盖检查
      - X-Ray检查
      - XRF检查
      - 电气测试
      - 外观检测
    • - 不合格和假冒检测
      - 故障分析
      - 电气测试
      - 生命周期和可靠性测试
      -百芯2021年成立元器件检测实验室
      了解更多 >

    电子元件供应服务

    立即查看
    SN:H1.38736LO76707V48Q1QC0S2
    在线联系我们
    黄经理 - 百芯智造销售经理在线,5 分钟前
    您的邮箱 *
    消息 *
    发送