DF200R12W1H3FB11BOMA1InfineonFast and solder-less assembly is possible using our EasyPACK™ 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
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DF200R12W1H3FB11BOMA1Infineon
库存紧缺
制造商:
Infineon
制造商型号#:
DF200R12W1H3FB11BOMA1
百芯编号#:
CM310938200
价格(CNY):
百芯库存:
0
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可供应量:
0
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产品描述:
Fast and solder-less assembly is possible using our EasyPACK™ 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.