* High-Performance Static CMOS Technology * Up to 150 MHz (6.67-ns Cycle Time) * 1.9-V/1.8-V Core, 3.3-V I/O Design * High-Performance 32-Bit CPU (TMS320C28x) * IEEE-754 Single-Precision Floating-Point Unit (FPU) (F2833x only) * 16 x 16 and 32 x 32 MAC Operations * 16 x 16 Dual MAC * Harvard Bus Architecture * Fast Interrupt Response and Processing * Unified Memory Programming Model * Code-Efficient (in C/C++ and Assembly) * Six-Channel DMA Controller (for ADC, McBSP,ePWM, XINTF, and SARAM) * 16-Bit or 32-Bit External Interface (XINTF) * Over 2M x 16 Address Reach * On-Chip Memory * F28335, F28235: 256K x 16 Flash, 34K x 16 SARAM * F28334, F28234: 128K x 16 Flash, 34K x 16 SARAM * F28332, F28232: 64K x 16 Flash, 26K x 16 SARAM * 1K x 16 OTP ROM * Boot ROM (8K x 16) * With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O) * Standard Math Tables * Clock and System Control * Dynamic PLL Ratio Changes Supported * On-Chip Oscillator * Watchdog Timer Module * GPIO0 to GPIO63 Pins Can Be Connected to One of the EightExternal Core Interrupts * Peripheral Interrupt Expansion (PIE) Block That Supports All58Peripheral Interrupts * 128-Bit Security Key/Lock * Protects Flash/OTP/RAM Blocks * Prevents Firmware Reverse Engineering * EnhancedControl Peripherals * Up to 18 PWM Outputs * Up to 6 HRPWM Outputs With 150 ps MEP Resolution * Up to 6 Event Capture Inputs * Up to 2 Quadrature Encoder Interfaces * Up to 8 32-Bit Timers (6 for eCAPs and 2 for eQEPs) * Up to 9 16-Bit Timers (6 for ePWMs and 3 XINTCTRs) * Three 32-Bit CPU Timers * Serial Port Peripherals * Up to 2 CAN Modules * Up to 3 SCI (UART) Modules * Up to 2 McBSP Modules (Configurable as SPI) * One SPI Module * One Inter-Integrated-Circuit (I2C) Bus * 12-Bit ADC, 16 Channels * 80-ns Conversion Rate * 2 x 8 Channel Input Multiplexer * Two Sample-and-Hold * Single/Simultaneous Conversions * Internal or External Reference * Up to 88 Individually Programmable, Multiplexed GPIO Pins WithInput Filtering * JTAG Boundary Scan Support * Advanced Emulation Features * Analysis and Breakpoint Functions * Real-Time Debug via Hardware * Development Support Includes * ANSI C/C++ Compiler/Assembler/Linker * Code Composer Studio IDE * DSP/BIOS * Digital Motor Control and Digital Power Software Libraries * Low-Power Modes and Power Savings * IDLE, STANDBY, HALT Modes Supported * Disable Individual Peripheral Clocks * Endianness: Little Endian * Package Options: * Lead-free, Green Packaging * Low-Profile Quad Flatpack (PGF, PTP) * MicroStar BGA (ZHH) * Plastic BGA (ZJZ) * Temperature Options: * A: –40°C to 85°C (PGF, ZHH, ZJZ) * S: –40°C to 125°C (PTP, ZJZ) * Q: –40°C to 125°C (PTP, ZJZ)
