The SN65DSI84-Q1 DSI-to-LVDS bridge features a single-channel MIPI D-PHY receiver front-end configuration with four lanes per channel operating at 1 Gbps per lane and a maximum input bandwidth of 4 Gbps. The bridge decodes MIPI DSI 18-bpp RGB666 and 24-bpp RGB888 packets and converts the formatted video data-stream to an LVDS output operating at pixel clocks operating from 25 MHz to 154 MHz, offering a dual-link LVDS or single-link LVDS with four data lanes per link.
The SN65DSI84-Q1 device is well suited for WUXGA (1920 × 1080) at 60 frames per second (fps) with up to 24 bits-per-pixel (bpp). Partial line buffering is implemented to accommodate the data stream mismatch between the DSI and LVDS interfaces.
The SN65DSI84-Q1 device is implemented in a small outline 10 mm × 10 mm HTQFP package with a 0.5-mm pitch, and operates across a temperature range from –40°C to 105°C.
Qualified for Automotive Applications
AEC-Q100 Qualified With the Following Results:
Device Temperature Grade 2: –40°C to 105°C Ambient Operating Temperature
Device HBM ESD Classification Level 3A
Device CDM ESD Classification Level C6
Implements MIPI D-PHY Version 1.00.00 Physical Layer Front-End and Display Serial Interface (DSI) Version 1.02.00
Single-Channel DSI Receiver Configurable for One, Two, Three, or Four D-PHY Data Lanes Per Channel Operating up to 1 Gbps Per Lane
Supports 18-bpp and 24-bpp DSI Video Packets with RGB666 and RGB888 Formats
Suitable for 60-fps WUXGA 1920 × 1200 Resolution at 18-bpp and 24-bpp Color, and 60-fps 1366 × 768 Resolution at 18-bpp and 24-bpp
Output Configurable for Single-Link or Dual-Link LVDS
Supports Single-Channel DSI to Dual-Link LVDS Operating Mode
LVDS Output-Clock Range of 25 MHz to 154 MHz in Dual-Link or Single-Link Mode
LVDS Pixel Clock May be Sourced from Free-Running Continuous D-PHY Clock or External Reference Clock (REFCLK)
1.8 V Main VCC Power Supply
Low Power Features Include SHUTDOWN Mode, Reduced LVDS Output Voltage Swing, Common Mode, and MIPI Ultra-Low Power State (ULPS) Support
LVDS Channel SWAP, LVDS PIN Order Reverse Feature for Ease of PCB Routing
Packaged in 64-pin 10 mm × 10 mm HTQFP (PAP) PowerPAD™ IC Package
