At the heart of the OMAP 4 platform is a powerful system-on-chip that includes the perfect balance of power efficiency and high performance. The OMAP 4 processor balances processing across four main engines: a programmable multimedia engine based on TI’s C64x DSP and power-efficient, multi-format hardware accelerators; general-purpose processing based on the dual-core ARM® Cortex™-A9 MPCore™ supporting symmetric multiprocessing (SMP) and capable of speeds of more than 1 GHz per core; a high-performance programmable graphics engine; and an Image Signal Processor (ISP) for unparalleled video and imaging performance. The OMAP 4 family includes two applications processors, both based on the dual-core Cortex-A9 MPCore general purpose processors: the OMAP4430 operates at up to 1 GHz, while the OMAP4460 operates at up to 1+ GHz. Both processors offer the full variety of subsystems and applications discussed below to deliver hardware and software system solutions that scale across customer roadmaps optimizing time to market, flexibility and R&D efficiency.
Dual-core ARM Cortex-A9 MPCore SMP general-purpose processors for higher performance and efficiency
IVA 3 Hardware accelerator
Delivers true 1080p multi-standard HD record and playback with the industry’s broadest support for multimedia codecs available today as well as programmability to add support for future codecs
Provides support for high definition stereoscopic 3D encode/decode (OMAP4430: 720p, OMAP4460: 1080p)
Image Signal Processor (ISP) for high-quality image and video capture, delivering digital SLR-like performance with 20-megapixel still image capture
Imagination Technologies POWERVR™ SGX540 3D graphics core for stunning 3D user interfaces and high intensity 3D mobile gaming
Audio back end (ABE) processor provides a virtual low power audio chip for significant power savings
Flexible system support
Composite TV output
HDMI v1.3 output to drive HD displays
WUXGA display support
Peripheral interfaces: MIPI serial camera and serial display interfaces, MIPI® SLIMbusSM, MMC/SD, USB 2.0 On-The-Go High Speed, UART, SPI, and more
Support for leading mobile OSes: Microsoft Windows Mobile, Symbian and Linux (Android, Limo)
45-nm mobile process technology for improved performance and power efficiency
Optimized power and audio management companion chips: TWL6030 and TWL6040
