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LPC2929FBD144 库存 & 价格

NXP ARM9 microcontroller; SRAM:56KB; 125MHz; LQFP144; Flash:768KB
90.95
LPC2929FBD144
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LPC2929FBD144 NXP
库存紧缺
NXP
  • 制造商:
    NXP
  • 制造商型号#:
    LPC2929FBD144
  • 百芯编号#:
    CM19117996
  • 价格(CNY):
    90.95
  • 百芯库存:
    10
  • 可供应量:
    29 个在库
    此为供应商库存,需要与销售确认
  • 产品描述:
    ARM9 microcontroller; SRAM:56KB; 125MHz; LQFP144; Flash:768KB
  • 文档: 3D模型
LPC2929FBD144 购买 LPC2929FBD144 库存和价格更新于 2025-06-16 03:50:22
  • 刷新
    器件型号: LPC2929FBD144
    百芯编号: CM19117996
    制造商: NXP
    封装: LQFP-144
    价格
    90.95
    总计: 39
    MOQ: 1
    库存地点: 香港
    发货日期: 2025/06/21 (预期 )
  • 购买
    *由于库存数量、价格不断波动,请 联系我们 获取型号最新价格和库存。

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    LPC2929FBD144 规格 显示相似产品 (99+)
    类型
    描述
    选择
    制造商
    NXP
    安装方式
    Surface Mount
    3D模型
     3D模型
    封装
    LQFP-144
    工作电压
    1.8 VDC
    时钟频率
    125 MHz
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    尺寸 & 包装
    类型
    描述
    工作温度
    -40℃ ~ 85℃
    产品生命周期
    Unknown
    符合标准
    类型
    描述
    RoHS标准
    RoHS Compliant
    含铅标准
    Lead Free
    产品概述
    • Overview
    • The LPC2926/2927/2929 combine an ARM968E-S CPU core with two integrated TCM blocks operating at frequencies of up to 125 MHz, Full-speed USB 2.0 OTG and device controller, CAN and LIN, 56 kB SRAM, up to 768 kB flash memory, external memory interface, three 10-bit ADCs, and multiple serial and parallel interfaces in a single chip targeted at consumer, industrial and communication markets. To optimize system power consumption, the LPC2926/2927/2929 has a very flexible Clock Generation Unit (CGU) that provides dynamic clock gating and scaling.
    • MoreLess
    • ## Features
    • * ARM968E-S processor running at frequencies of up to 125 MHz maximum.
    • * Multi-layer AHB system bus at 125 MHz with four separate layers.
    • * On-chip memory:
    • * Two Tightly Coupled Memories (TCM), 32 kB Instruction TCM (ITCM), 32 kB Data TCM (DTCM).
    • * Two separate internal Static RAM (SRAM) instances; 32 kB SRAM and 16 kB SRAM.
    • * 8 kB ETB SRAM also available for code execution and data.
    • * Up to 768 kB high-speed flash-program memory.
    • * 16 kB true EEPROM, byte-erasable and programmable.
    • * Dual-master, eight-channel GPDMA controller on the AHB multi-layer matrix which can be used with the Serial Peripheral Interface (SPI) interfaces and the UARTs, as well as for memory-to-memory transfers including the TCM memories.
    • * External Static Memory Controller (SMC) with eight memory banks; up to 32-bit data bus; up to 24-bit address bus.
    • * Serial interfaces:
    • * USB 2.0 full-speed device/OTG controller with dedicated DMA controller and on-chip device PHY.
    • * Two-channel CAN controller supporting FullCAN and extensive message filtering.
    • * Two LIN master controllers with full hardware support for LIN communication. The LIN interface can be configured as UART to provide two additional UART interfaces.
    • * Two 550 UARTs with 16-byte Tx and Rx FIFO depths, DMA support, and RS485/EIA-485 (9-bit) support.
    • * Three full-duplex Q-SPIs with four slave-select lines; 16 bits wide; 8 locations deep; Tx FIFO and Rx FIFO.
    • * Two I²C-bus interfaces.
    • * Other peripherals:
    • * One 10-bit ADC with 5.0 V measurement range and eight input channels with conversion times as low as 2.44 μs per channel.
    • * Two 10-bit ADCs, 8-channels each, with 3.3 V measurement range provide an additional 16 analog inputs with conversion times as low as 2.44 μs per channel. Each channel provides a compare function to minimize interrupts.
    • * Multiple trigger-start option for all ADCs: timer, PWM, other ADC, and external signal input.
    • * Four 32-bit timers each containing four capture-and-compare registers linked to I/Os.
    • * Four six-channel PWMs (Pulse Width Modulators) with capture and trap functionality.
    • * Two dedicated 32-bit timers to schedule and synchronize PWM and ADC.
    • * Quadrature encoder interface that can monitor one external quadrature encoder.
    • * 32-bit watchdog with timer change protection, running on safe clock.
    • * Up to 104 general-purpose I/O pins with programmable pull-up, pull-down, or bus keeper.
    • * Vectored Interrupt Controller (VIC) with 16 priority levels.
    • * Up to 21 level-sensitive external interrupt pins, including USB, CAN and LIN wake-up features.
    • * Configurable clock-out pin for driving external system clocks.
    • * Processor wake-up from power-down via external interrupt pins; CAN or LIN activity.
    • * Flexible Reset Generator Unit (RGU) able to control resets of individual modules.
    • * Flexible Clock-Generation Unit (CGU0) able to control clock frequency of individual modules:
    • * On-chip very low-power ring oscillator; fixed frequency of 0.4 MHz; always on to provide a Safe_Clock source for system monitoring.
    • * On-chip crystal oscillator with a recommended operating range from 10 MHz to 25 MHz. PLL input range 10 MHz to 25 MHz.
    • * On-chip PLL allows CPU operation up to a maximum CPU rate of 125 MHz.
    • * Generation of up to 11 base clocks.
    • * Seven fractional dividers.
    • * Second CGU (CGU1) with its own PLL generates USB clocks and a configurable clock output.
    • * Highly configurable system Power Management Unit (PMU):
    • * clock control of individual modules.
    • * allows minimization of system operating power consumption in any configuration.
    • * Standard ARM test and debug interface with real-time in-circuit emulator.
    • * Boundary-scan test supported.
    • * ETM/ETB debug functions with 8 kB of dedicated SRAM also accessible for application code and data storage.
    • * Dual power supply:
    • * CPU operating voltage: 1.8 V ± 5 %.
    • * I/O operating voltage: 2.7 V to 3.6 V; inputs tolerant up to 5.5 V.
    • * 144-pin LQFP package.
    • * –40 ℃ to +85 ℃ ambient operating temperature range.
    • ## Features

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