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AM5K2E02 库存 & 价格

TI Sitara Processor: Dual ARM Cortex-A15
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AM5K2E02 TI
库存紧缺
TI
  • 制造商:
    TI
  • 制造商型号#:
    AM5K2E02
  • 百芯编号#:
    CM1762675533
  • 价格(CNY):
  • 产品描述:
    Sitara Processor: Dual ARM Cortex-A15
  • 文档: 符合 RoHS 标准 3D模型
AM5K2E02 购买 AM5K2E02 库存和价格更新于 2025-06-15 03:50:22
  • 刷新
    器件型号: AM5K2E02
    百芯编号: CM1762675533
    制造商: TI
    价格
    MOQ: 1
    库存地点: 香港
    发货日期: 2025/06/20 (预期 )
  • 购买
    *由于库存数量、价格不断波动,请 联系我们 获取型号最新价格和库存。

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    AM5K2E02 数据规格书
    AM5K2E02 数据手册Datasheet
    252 Pages, 1834 KB
    查看
    符合标准
    类型
    描述
    RoHS标准
    RoHS Compliant
    含铅标准
    Lead Free
    产品概述
    • The AM5K2E0x is a high performance device based on TI’s KeyStone II Multicore SoC Architecture, incorporating the most performance-optimized Cortex-A15 processor dual-core or quad-core CorePac that can run at a core speed of up to 1.4 GHz. TI’s AM5K2E0x device enables a high performance, power-efficient and easy to use platform for developers of a broad range of applications such as enterprise grade networking end equipment, data center networking, avionics and defense, medical imaging, test and automation.
    • TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (for example, ARM CorePac (Cortex-A15 Processor Quad Core CorePac), network processing, and uses a queue-based communication system that allows the device resources to operate efficiently and seamlessly. This unique device architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to high-speed IO, to each operate at maximum efficiency with no blocking or stalling.
    • The AM5K2E0x KeyStone II device integrates a large amount of on-chip memory. The Cortex-A15 processor cores each have 32KB of L1Data and 32KB of L1 Instruction cache. The up to four Cortex A15 cores in the ARM CorePac share a 4MB L2 Cache. The device also integrates 2MB of Multicore Shared Memory (MSMC) that can be used as a shared L3 SRAM. All L2 and MSMC memories incorporate error detection and error correction. For fast access to external memory, this device includes a 64-bit DDR-3 (72-bit with ECC support) external memory interface (EMIF) running at 1600 MTPS.
    • The device enables developers to use a variety of development and debugging tools that include GNU GCC, GDB, Open source Linux, Eclipse based debugging environment enabling kernel and user space debugging using a variety of Eclipse plug-ins including TI"s industry leading IDE Code Composer Studio.
    • ARM® Cortex®-A15 MPCore™ CorePac
    • Up to Four ARM Cortex-A15 Processor Cores at
    • up to 1.4-GHz
    • 4MB L2 Cache Memory Shared by all Cortex-
    • A15 Processor Cores
    • Full Implementation of ARMv7-A Architecture
    • Instruction Set
    • 32KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE)
    • Master Port, Connected to MSMC (Multicore
    • Shared Memory Controller) for Low Latency
    • Access to SRAM and DDR3
    • Multicore Shared Memory Controller (MSMC)
    • 2 MB SRAM Memory for ARM CorePac
    • Memory Protection Unit for Both SRAM and
    • DDR3_EMIF
    • Multicore Navigator
    • 8k Multi-Purpose Hardware Queues with Queue
    • Manager
    • One Packet-Based DMA Engine for Zero-
    • Overhead Transfers
    • Network Coprocessor
    • Packet Accelerator Enables Support for
    • Transport Plane IPsec, GTP-U, SCTP,
    • PDCP
    • L2 User Plane PDCP (RoHC, Air Ciphering)
    • 1 Gbps Wire Speed Throughput at 1.5
    • MPackets Per Second
    • Security Accelerator Engine Enables Support for
    • IPSec, SRTP, 3GPP and WiMAX Air
    • Interface, and SSL/TLS Security
    • ECB, CBC, CTR, F8, A5/3, CCM, GCM,
    • HMAC, CMAC, GMAC, AES, DES, 3DES,
    • Kasumi, SNOW 3G, SHA-1, SHA-2 (256-bit
    • Hash), MD5
    • Up to 6.4 Gbps IPSec and 3 Gbps Air
    • Ciphering
    • Ethernet Subsystem
    • Eight SGMII Ports with Wire Rate Switching
    • IEEE1588 v2 (with Annex D/E/F) Support
    • 8 Gbps Total Ingress/Egress Ethernet BW
    • from Core
    • Audio/Video Bridging (802.1Qav/D6.0)
    • QOS Capability
    • DSCP Priority Mapping
    • Peripherals
    • Two PCIe Gen2 Controllers with Support for
    • Two Lanes per Controller
    • Supports Up to 5 GBaud
    • One HyperLink
    • Supports Connections to Other KeyStone Architecture
    • Devices Providing Resource
    • Scalability
    • Supports Up to 50 GBaud
    • 10-Gigabit Ethernet (10-GbE) Switch Subsystem
    • Two SGMII/XFI Ports with Wire Rate
    • Switching and MACSEC Support
    • IEEE1588 v2 (with Annex D/E/F) Support
    • One 72-Bit DDR3/DDR3L Interface with Speeds Up
    • to 1600 MTPS in DDR3 Mode
    • EMIF16 Interface
    • Two USB 2.0/3.0 Controllers
    • USIM Interface
    • Two UART Interfaces
    • Three I2C Interfaces
    • 32 GPIO Pins
    • Three SPI Interfaces
    • One TSIP
    • Support 1024 DS0s
    • Support 2 Lanes at 32.768/16.3848.192
    • Mbps Per Lane
    • System Resources
    • Three On-Chip PLLs
    • SmartReflex Automatic Voltage Scaling
    • Semaphore Module
    • Twelve 64-Bit Timers
    • Five Enhanced Direct Memory Access (EDMA)
    • Modules
    • Commercial Case Temperature:
    • 0°C to 85°C
    • Extended Case Temperature:
    • –40°C to 100°C

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