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AM3871 库存 & 价格

TI Sitara Processor: ARM Cortex-A8, Ethernet
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AM3871 TI
TI
  • 制造商:
    TI
  • 制造商型号#:
    AM3871
  • 百芯编号#:
    CM637223837
  • 价格(CNY):
  • 百芯库存:
    231
  • 可供应量:
    187 个在库
    此为供应商库存,需要与销售确认
  • 产品描述:
    Sitara Processor: ARM Cortex-A8, Ethernet
  • 文档: 符合 RoHS 标准 3D模型
AM3871 购买 AM3871 库存和价格更新于 2025-06-14 03:50:22
  • 刷新
    器件型号: AM3871
    百芯编号: CM637223837
    制造商: TI
    价格
    总计: 418
    MOQ: 1
    库存地点: 香港
    发货日期: 2025/06/19 (预期 )
  • 购买
    *由于库存数量、价格不断波动,请 联系我们 获取型号最新价格和库存。

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    类型
    描述
    选择
    制造商
    TI
    安装方式
    Surface Mount
    3D模型
     3D模型
    封装
    FCBGA-684
    显示相似产品
    AM3871 数据规格书
    AM3871 数据手册Datasheet
    358 Pages, 2613 KB
    2012/04/10
    查看
    符合标准
    类型
    描述
    RoHS标准
    RoHS Compliant
    含铅标准
    Lead Free
    产品概述
    • AM387x Sitara ARM processors are highly integrated, programmable platforms that leverage the Sitara processor technology.
    • The device enables Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The device also combines programmable ARM processing with a highly integrated peripheral set.
    • The AM387x Sitara ARM processors also present OEMs and ODMs with new levels of processor scalability and software reuse. An OEM or ODM who used the AM387x processors in a design and can make a similar product with added features could scale up to the pin-compatible and software-compatible TMS320DM814x processors from TI. The TMS320DM814x DaVinci video processors add a powerful C674x core DSP along with a video encoder and decoder to the hardware on the AM387x. Additionally, OEMs or ODMs that have used the AM387x or DM814x processors and find a need for a faster ARM and/or DSP core performance could scale up to the software-compatible AM389x or TMS320DM816x devices with higher core speeds.
    • Programmability is provided by an ARM Cortex-A8 RISC CPU with Neon extension. The ARM processor lets developers keep control functions separate from algorithms programmed on coprocessors, thus reducing the complexity of the system software. The ARM Cortex-A8 32-bit RISC core with Neon floating-point extension includes: 32KB of instruction cache; 32KB of data cache; 512KB of L2 cache; 48KB of boot ROM; and 64KB of RAM.
    • The AM387x Sitara ARM processors also include an SGX530 3D graphics engine to off-load many graphics processing tasks from the ARM core, making more ARM MIPS available for common processing tasks on algorithms. Additionally, the AM387x processor has a complete set of development tools for the ARM which include C compilers and a Microsoft Windows debugger interface for visibility into source code execution.
    • High-Performance Sitara™ ARM® Processors
    • ARM Cortex®-A8 Core
    • ARMv7 Architecture
    • In-Order, Dual-Issue, Superscalar Processor Core
    • Neon™ Multimedia Architecture
    • Supports Integer and Floating Point
    • Jazelle® RCT Execution Environment
    • ARM Cortex-A8 Memory Architecture
    • 32KB of Instruction and Data Caches
    • 512KB of L2 Cache
    • 64KB of RAM, 48KB of Boot ROM
    • 128KB of On-Chip Memory Controller (OCMC) RAM
    • Imaging Subsystem (ISS)
    • Camera Sensor Connection
    • Parallel Connection for Raw (up to 16-Bit) and BT.656 or BT.1120 (8- and 16-Bit)
    • Image Sensor Interface (ISIF) for Handling Image and Video Data From the Camera Sensor
    • Resizer
    • Resizing Image and Video From 1/16x to 8x
    • Generating Two Different Resizing Outputs Concurrently
    • Media Controller
    • Controls the HDVPSS and ISS
    • SGX530 3D Graphics Engine
    • Delivers up to 25 MPoly/sec
    • Universal Scalable Shader Engine (USSE™)
    • Direct3D Mobile, OpenGLES 1.1 and 2.0, OpenVG 1.0, OpenMax API Support
    • Advanced Geometry DMA-Driven Operation
    • Programmable HQ Image Anti-Aliasing
    • Endianness
    • ARM Instructions and Data – Little Endian
    • HD Video Processing Subsystem (HDVPSS)
    • Two 165-MHz, 2-channel HD Video Capture Modules
    • One 16- or 24-Bit Input or Dual 8-Bit SD Input Channels
    • One 8-, 16-, or 24-Bit Input and One 8-Bit Only Input Channels
    • Two 165-MHz HD Video Display Outputs
    • One 16-, 24-, or 30-Bit Output and One 16- or 24-Bit Output
    • Composite or S-Video Analog Output
    • Macrovision® Support Available
    • Digital HDMI 1.3 Transmitter With Integrated PHY
    • Advanced Video Processing Features Such as Scan, Format, Rate Conversion
    • Three Graphics Layers and Compositors
    • Dual 32-Bit DDR2/DDR3 SDRAM Interfaces
    • Supports up to DDR2-800 and DDR3-1066
    • Up to Eight x 8 Devices Comprise 2GB of the Total Address Space
    • Dynamic Memory Manager (DMM)
    • Programmable Multizone Memory Mapping and Interleaving
    • Enables Efficient 2D Block Accesses
    • Supports Tiled Objects in 0°, 90°, 180°, or 270° Orientation and Mirroring
    • Optimizes Interlaced Accesses
    • General-Purpose Memory Controller (GPMC)
    • 8- or 16-Bit Multiplexed Address and Data Bus
    • 512MB of Address Space Divided Among up to 8 Chip Selects
    • Glueless Interface to NOR Flash, NAND Flash (BCH/Hamming Error Code Detection), SRAM and Pseudo-SRAM
    • Error Locator Module (ELM) Outside of GPMC to Provide up to 16-Bit or 512-Byte Hardware ECC for NAND
    • Flexible Asynchronous Protocol Control for Interface to FPGA, CPLD, ASICs, and so Forth
    • Enhanced Direct Memory Access (EDMA) Controller
    • Four Transfer Controllers
    • 64 Independent DMA Channels and 8 Independent QDMA Channels
    • Dual-Port Ethernet (10/100/1000 Mbps) With Optional Switch
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • MII/RMII/GMII/RGMII Media Independent Interfaces
    • Management Data I/O (MDIO) Module
    • Reset Isolation
    • IEEE 1588 Time-Stamping and Industrial Ethernet Protocols
    • Dual USB 2.0 Ports With Integrated PHYs
    • USB2.0 High- and Full-Speed Clients
    • USB2.0 High-, Full-, and Low-Speed Hosts, or OTG
    • Supports End-point 0–15
    • One PCI-Express 2.0 Port With Integrated PHY
    • Single Port With One Lane at 5.0 GT/s
    • Configurable as Root Complex or End-point
    • Eight 32-Bit General-Purpose Timers (Timer1–Timer8)
    • One System Watchdog Timer (WDT0)
    • Six Configurable UART/IrDA/CIR Modules
    • UART0 With Modem Control Signals
    • Supports up to 3.6864 Mbps UART0/1/2
    • Supports up to 12 Mbps UART3/4/5
    • SIR, MIR, FIR (4.0 MBAUD), and CIR
    • Four Serial Peripheral Interfaces (SPIs) (up to
    • 48 MHz)
    • Each With Four Chip Selects
    • Three MMC/SD/SDIO Serial Interfaces (up to
    • 48 MHz)
    • Three Supporting up to 1-, 4-, or 8-Bit Modes
    • Dual Controller Area Network (DCAN) Modules
    • CAN Version 2 Part A, B
    • Four Inter-Integrated Circuit (I2C Bus) Ports
    • Six Multichannel Audio Serial Ports (McASPs)
    • Dual 10 Serializer Transmit and Receive Ports
    • Quad Four Serializer Transmit and Receive Ports
    • DIT-Capable For S/PDIF (All Ports)
    • Multichannel Buffered Serial Port (McBSP)
    • Transmit and Receive Clocks up to 48 MHz
    • Two Clock Zones and Two Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • Serial ATA (SATA) 3.0 Gbps Controller With Integrated PHY
    • Direct Interface to One Hard Disk Drive
    • Hardware-Assisted Native Command Queuing (NCQ) from up to 32 Entries
    • Supports Port Multiplier and Command-Based Switching
    • Real-Time Clock (RTC)
    • One-Time or Periodic Interrupt Generation
    • Up to 128 General-Purpose I/O (GPIO) Pins
    • One Spin Lock Module With up to 128 Hardware Semaphores
    • One Mailbox Module With 12 Mailboxes
    • On-Chip ARM ROM Bootloader (RBL)
    • Power, Reset, and Clock Management
    • Multiple Independent Core Power Domains
    • Multiple Independent Core Voltage Domains
    • Support for Three Operating Points (OPP100, OPP120, OPP166) per Voltage Domain
    • Clock Enable and Disable Control for Subsystems and Peripherals
    • 32KB of Embedded Trace Buffer (ETB) and
    • 5-Pin Trace Interface for Debug
    • IEEE 1149.1 (JTAG) Compatible
    • 684-Pin Pb-Free BGA Package (CYE Suffix),
    • 0.8-mm Ball Pitch With Via Channel Technology to Reduce PCB Cost
    • 45-nm CMOS Technology
    • 1.8- and 3.3-V Dual Voltage Buffers for General I/O
    • All trademarks are the property of their respective owners.

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