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W25N01GWTCIG 数据手册 Datasheet - Winbond Electronics

制造商：
Winbond Electronics
封装：
BGA
描述：
NAND Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 1G-bit 128M x 8 8ns 24Pin TFBGA Tray
文档：

W25N01GWTCIG 数据手册 (2 页) Hot

型号规则信息在 1页

更新时间： 2023/11/28 02:27:01 (UTC+8)

W25N01GWTCIG 数据手册PDF (2 页)

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W25N01GWTCIG 文档

W25N01GWTCIG 数据手册

Winbond Electronics

2 页, 68 KB

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