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OMAPL138BZCEA3E 产品设计参考 - TI

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OMAPL138BZCEA3E 产品设计参考

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SPRS586F JUNE 2009REVISED AUGUST 2013
OMAP-L138 C6000™ DSP+ARM® Processor
Check for Samples: OMAP-L138
1 OMAP-L138 C6000™ DSP+ARM Processor
1.1 Features
12
Precision/32-Bit) and DP (IEEE Double
Dual-Core SoC
Precision/64-Bit) Floating Point
375-/456-MHz ARM926EJ-S™ RISC MPU
Supports up to Four SP Additions Per
375-/456-MHz C674x Fixed- and Floating-
Clock, Four DP Additions Every Two
Point VLIW DSP
Clocks
ARM926EJ-S Core
Supports up to Two Floating-Point (SP or
32- and 16-Bit (Thumb®) Instructions
DP) Reciprocal Approximation (RCPxP)
DSP Instruction Extensions
and Square-Root Reciprocal
Single-Cycle MAC
Approximation (RSQRxP) Operations Per
ARM Jazelle® Technology
Cycle
EmbeddedICE-RT™ for Real-Time Debug
Two Multiply Functional Units:
ARM9™ Memory Architecture
Mixed-Precision IEEE Floating-Point
Multiply Supported up to:
16KB of Instruction Cache
2 SP x SP SP Per Clock
16KB of Data Cache
2 SP x SP DP Every Two Clocks
8KB of RAM (Vector Table)
2 SP x DP DP Every Three Clocks
64KB of ROM
2 DP x DP DP Every Four Clocks
C674x Instruction Set Features
Fixed-Point Multiply Supports Two 32 x
Superset of the C67x+™ and C64x+™ ISAs
32-Bit Multiplies, Four 16 x 16-Bit
Up to 3648 MIPS and 2746 MFLOPS
Multiplies, or Eight 8 x 8-Bit Multiplies per
Byte-Addressable (8-, 16-, 32-, and 64-Bit
Clock Cycle, and Complex Multiples
Data)
Instruction Packing Reduces Code Size
8-Bit Overflow Protection
All Instructions Conditional
Bit-Field Extract, Set, Clear
Hardware Support for Modulo Loop
Normalization, Saturation, Bit-Counting
Operation
Compact 16-Bit Instructions
Protected Mode Operation
C674x Two-Level Cache Memory Architecture
Exceptions Support for Error Detection and
32KB of L1P Program RAM/Cache
Program Redirection
32KB of L1D Data RAM/Cache
Software Support
256KB of L2 Unified Mapped RAM/Cache
TI DSP/BIOS™
Flexible RAM/Cache Partition (L1 and L2)
Chip Support Library and DSP Library
Enhanced Direct-Memory-Access Controller 3
128KB of RAM Shared Memory
(EDMA3):
1.8-V or 3.3-V LVCMOS I/Os (Except for USB
2 Channel Controllers
and DDR2 Interfaces)
3 Transfer Controllers
Two External Memory Interfaces:
64 Independent DMA Channels
EMIFA
16 Quick DMA Channels
NOR (8- or 16-Bit-Wide Data)
Programmable Transfer Burst Size
NAND (8- or 16-Bit-Wide Data)
TMS320C674x™ Floating-Point VLIW DSP Core
16-Bit SDRAM with 128-MB Address
Load-Store Architecture with Nonaligned
Space
Support
DDR2/Mobile DDR Memory Controller with
64 General-Purpose Registers (32 Bit)
one of the following:
Six ALU (32- and 40-Bit) Functional Units
16-Bit DDR2 SDRAM with 256-MB
Supports 32-Bit Integer, SP (IEEE Single
Address Space
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to
Copyright © 2009–2013, Texas Instruments Incorporated
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
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