下载
Freescale Semiconductor, Inc.
Application Note
© Freescale Semiconductor, Inc., 2014. All rights reserved.
Document Number: AN2409
Rev. 3.0, 10/2014
Contents
1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
2 Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
3 Small Outline Integrated Circuit . . . . . . . . . . . . .2
4 Printed Circuit Board Guidelines . . . . . . . . . . . .4
5 Board Assembly . . . . . . . . . . . . . . . . . . . . . . . .10
6 Repair and Rework Procedure . . . . . . . . . . . . .14
7 Board Level Reliability . . . . . . . . . . . . . . . . . . .16
8 Thermal Characteristics . . . . . . . . . . . . . . . . . .18
9 Case Outline Drawing, MCDS and MSL Rating 20
10 Package Handling . . . . . . . . . . . . . . . . . . . . .21
11 References . . . . . . . . . . . . . . . . . . . . . . . . . . .26
12 Revision History . . . . . . . . . . . . . . . . . . . . . . .27
1 Introduction
This application note provides guidelines for handling and
assembly of Freescale Small Outline Integrated Circuit (SOIC)
package during Printed Circuit Board (PCB) assembly.
Guidelines for PCB design, rework, and package performance
information such as Moisture Sensitivity Level (MSL) rating, board
level reliability, mechanical and thermal resistance data are
included for reference.
2 Scope
This document contains generic information that encompasses
various Freescale SOIC packages assembled internally or at
external subcontractors. Specific information about each device is
not provided. To develop a specific solution, actual experience and
development efforts are required to optimize the assembly process
and application design per individual device requirements, industry
standards (such as IPC and JEDEC), and prevalent practices in
the assembly environment. For more details about the specific
devices contained in this note, visit
www.freescale.com or contact
the appropriate product application team.
Small Outline Integrated Circuit (SOIC) Package
