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MPC860SRCZQ50D4 应用笔记 - Motorola

  • 制造商:
    Motorola
  • 封装
    BGA
更新时间: 2025-06-18 05:55:40 (UTC+8)

MPC860SRCZQ50D4 应用笔记

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This hardware specification contains detailed information on power considerations, DC/AC
electrical characteristics, and AC timing specifications for the MPC860 family.
This hardware specification covers the following topics:
Topic Page
Section 1, “Overview” 2
Section 2, “Features” 2
Section 3, “Maximum Tolerated Ratings” 6
Section 4, “Thermal Characteristics” 7
Section 5, “Power Dissipation” 8
Section 6, “DC Characteristics” 8
Section 7, “Thermal Calculation and Measurement” 10
Section 8, “Layout Practices” 12
Section 9, “Bus Signal Timing” 12
Section 10, “IEEE 1149.1 Electrical Specifications” 40
Section 11, “CPM Electrical Characteristics” 42
Section 12, “UTOPIA AC Electrical Specifications” 65
Section 13, “FEC Electrical Characteristics” 67
Section 14, “Mechanical Data and Ordering Information” 71
Section 15, “Document Revision History” 76
Advance Information
MPC860EC
Rev. 6.3 9/2003
MPC860 Family
Hardware Specications

MPC860SRCZQ50D4 数据手册 PDF

MPC860SRCZQ50D4 应用笔记
Motorola
80 页, 485 KB

MPC860SRCZQ50 数据手册 PDF

MPC860SRCZQ50D4
数据手册
Freescale
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 50MHz 357Pin BGA Tray
MPC860SRCZQ50D4
产品设计参考
NXP
MPU PowerQUICC MPC8xx Processor RISC 32Bit 0.32um 50MHz 357Pin BGA Tray
MPC860SRCZQ50D4
应用笔记
Motorola
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