* General * Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives, and Power Management * Quick Hardware Design With TI Module Collateral and Reference Designs * Operating Temperature: -40°C to 85°C Industrial Temperature Grade * Small Form Factor: 13.3 × 13.4 × 2 mm * 100-Pin MOC Package * FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas * Wi-Fi * WLAN Baseband Processor and RF Transceiver Support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n * 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for High Throughput: 80 Mbps (TCP), 100 Mbps (UDP)o2.4-GHz MRC Support for Extended Range and 5-GHz Diversity Capable * Fully Calibrated: Production Calibration Not Required * 4-Bit SDIO Host Interface Support * Wi-Fi Direct Concurrent operation (Multichannel, Multirole) * Blue to oth and BLE (WL1837MOD only) * Bluetooth 4.1 Compliance and CSA2 Support * Host Controller Interface (HCI) Transport for Bluetooth over UART * Dedicated Audio Processor Support of SBC Encoding + A2DP * Dual-Mode Bluetooth and Bluetooth LE * TI’s Bluetooth- and LE-Certified Stack * Key Benefits * Reduces Design overhead * Differentiated Use-Cases by Configuring WiLink 8 Simultaneously in Two Roles (STA and AP) to Connect Directly With other Wi-Fi Device son Different RF Channel (Wi-Fi Networks) * Best-in-Class Wi-Fi With High-Performance Audio and Video Streaming Reference Applications With up to 1.4X the Range Versus one Antenna * Different Provisioning Methods for In-Home Devices Connectivity to Wi-Fi in one Step * Lowest Wi-Fi Power Consumption in Connected Idle ( * Configurable Wake on WLAN Filters to Only Wake up the System * Wi-Fi-Blueto th Single Antenna Coexistence
