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TMS5703137DPGEQQ1 库存 & 价格

TI MCU 16Bit/32Bit ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V Automotive 144Pin LQFP
4864.62
TMS5703137DPGEQQ1
显示的图像仅供参考,应从产品数据表中获得准确的规格。
TMS5703137DPGEQQ1 TI
TI
  • 制造商:
    TI
  • 制造商型号#:
    TMS5703137DPGEQQ1
  • 百芯编号#:
    CM2442275
  • 价格(CNY):
    4864.62
  • 百芯库存:
    1,000
  • 可供应量:
    217 个在库
    此为供应商库存,需要与销售确认
  • 产品类别:
    微控制器,MCU,单片机
  • 产品描述:
    MCU 16Bit/32Bit ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V Automotive 144Pin LQFP
  • 文档: 3D模型
TMS5703137DPGEQQ1 购买 TMS5703137DPGEQQ1 库存和价格更新于 2025-06-12 03:50:22
  • 刷新
    器件型号: TMS5703137DPGEQQ1
    百芯编号: CM2442275
    制造商: TI
    封装: LQFP-144
    价格
    4864.62
    总计: 1,217
    MOQ: 1
    库存地点: 香港
    发货日期: 2025/06/17 (预期 )
  • 购买
    *由于库存数量、价格不断波动,请 联系我们 获取型号最新价格和库存。

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    TMS5703137DPGEQQ1 规格 显示相似产品 (99+)
    类型
    描述
    选择
    制造商
    TI
    类别
    微控制器,MCU,单片机
    3D模型
     3D模型
    安装方式
    Surface Mount
    引脚数
    144 Pin
    封装
    LQFP-144
    频率
    160 MHz
    时钟频率
    160 MHz
    RAM大小
    256 KB
    FLASH内存容量
    3145728 B
    模数转换数(ADC)
    2 ADC
    工作温度(Max)
    125 ℃
    工作温度(Min)
    -40 ℃
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    TMS5703137DPGEQQ1 其它数据手册Datasheet
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    2016/05/31
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    尺寸 & 包装
    类型
    描述
    工作温度
    -40℃ ~ 125℃ (TA)
    产品生命周期
    Active
    包装方式
    Tray
    符合标准
    类型
    描述
    RoHS标准
    RoHS Compliant
    含铅标准
    Lead Free
    产品概述
    • The TMS570LS3137 device is a high-performance automotive-grade microcontroller family for safety systems. The safety architecture includes dual CPUs in lockstep, CPU and memory BIST logic, ECC on both the flash and the data SRAM, parity on peripheral memories, and loopback capability on peripheral I/Os.
    • The TMS570LS3137 device integrates the ARM Cortex-R4F Floating-Point CPU. The CPU offers an efficient 1.66 DMIPS/MHz, and has configurations that can run up to 180 MHz, providing up to 298 DMIPS. The device supports the word-invariant big-endian [BE32] format.
    • The TMS570LS3137 device has 3MB of integrated flash and 256KB of data RAM. Both the flash and RAM have single-bit error correction and double-bit error detection. The flash memory on this device is a nonvolatile, electrically erasable, and programmable memory implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3-V supply input (same level as I/O supply) for all read, program, and erase operations. When in pipeline mode, the flash operates with a system clock frequency of up to 180 MHz. The SRAM supports single-cycle read and write accesses in byte, halfword, word, and double-word modes.
    • The TMS570LS3137 device features peripherals for real-time control-based applications, including two Next Generation High-End Timer (N2HET) timing coprocessors and two 12-bit Analog-to-Digital Converters (ADCs) supporting up to 24 inputs.
    • The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The N2HET can be used for pulse-width-modulated outputs, capture or compare inputs, or GPIO. The N2HET is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. A High-End Timer Transfer Unit (HTU) can perform DMA-type transactions to transfer N2HET data to or from main memory. A Memory Protection Unit (MPU) is built into the HTU.
    • The device has two 12-bit-resolution MibADCs with 24 channels and 64 words of parity-protected buffer RAM each. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. Sixteen channels are shared between the two MibADCs. There are three separate groupings. Each sequence can be converted once when triggered or configured for continuous conversion mode. The MibADC has a 10-bit mode for use when compatibility with older devices or faster conversion time is desired.
    • The device has multiple communication interfaces: three MibSPIs, two SPIs, one LIN, one SCI, three DCANs, one I2C module, one Ethernet, and one FlexRay controller. The SPIs provide a convenient method of serial high-speed communication between similar shift-register type devices. The LIN supports the Local Interconnect standard 2.0 and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format.
    • The DCAN supports the CAN 2.0 (A and B) protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 Mbps. The DCAN is ideal for systems operating in noisy and harsh environments (for example, automotive vehicle networking and industrial fieldbus) that require reliable serial communication or multiplexed wiring.
    • The FlexRay controller uses a dual-channel serial, fixed time base multimaster communication protocol with communication rates of 10 Mbps per channel. A FlexRay Transfer Unit (FTU) enables autonomous transfers of FlexRay data to and from the CPU main memory. Transfers are protected by a dedicated, built-in MPU. The Ethernet module supports MII, RMII, and MDIO interfaces.
    • The I2C module is a multimaster communication module providing an interface between the microcontroller and an I2C-compatible device through the I2C serial bus. The I2C supports speeds of 100 and 400 Kbps.
    • The Frequency-Modulated Phase-Locked Loop (FMPLL) clock module is used to multiply the external frequency reference to a higher frequency for internal use. There are two FMPLL modules on this device. These modules, when enabled, provide two of the seven possible clock source inputs to the Global Clock Module (GCM). The GCM manages the mapping between the available clock sources and the device clock domains.
    • The device also has an External Clock Prescaler (ECP) module that when enabled, outputs a continuous external clock on the ECLK pin (or ball). The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an indicator of the device operating frequency.
    • The DMA controller has 16 channels, 32 control packets, and parity protection on its memory. An MPU is built into the DMA to limit the DMA to prescribed areas of memory and to protect the rest of the memory system from any malfunction of the DMA.
    • The Error Signaling Module (ESM) monitors all device errors and determines whether an interrupt is generated or the external ERROR pin is toggled when a fault is detected. The ERROR pin can be monitored externally as an indicator of a fault condition in the microcontroller.
    • The External Memory Interface (EMIF) provides off-chip expansion capability with the ability to interface to synchronous DRAM (SDRAM) devices, asynchronous memories, peripherals or FPGA devices.
    • Several interfaces are implemented to enhance the debugging capabilities of application code. In addition to the built-in ARM Cortex-R4F CoreSight debug features, an External Trace Macrocell (ETM) provides instruction and data trace of program execution. For instrumentation purposes, a RAM Trace Port (RTP) module is implemented to support high-speed tracing of RAM and peripheral accesses by the CPU or any other master. A Data Modification Module (DMM) gives the ability to write external data into the device memory. Both the RTP and DMM have no or only minimum impact on the program execution time of the application code. A Parameter Overlay Module (POM) can reroute flash accesses to internal memory or to the EMIF. This rerouting allows the dynamic calibration against production code of parameters and tables without rebuilding the code to explicitly access RAM or halting the processor to reprogram the data flash.
    • With integrated safety features and a wide choice of communication and control peripherals, the TMS570LS3137 device is an ideal solution for high-performance real-time control applications with safety-critical requirements.

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