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TMS320C54V90 库存 & 价格

TI DSP (DSP Only) for Embedded V90 Modem Solution [Not Recommended For New Designs (NRND)]
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TMS320C54V90 TI
TI
  • 制造商:
    TI
  • 制造商型号#:
    TMS320C54V90
  • 百芯编号#:
    CM435546710
  • 价格(CNY):
  • 百芯库存:
    247
  • 可供应量:
    143 个在库
    此为供应商库存,需要与销售确认
  • 产品描述:
    DSP (DSP Only) for Embedded V90 Modem Solution [Not Recommended For New Designs (NRND)]
  • 文档: 符合 RoHS 标准 3D模型
TMS320C54V90 购买 TMS320C54V90 库存和价格更新于 2025-06-13 03:50:22
  • 刷新
    器件型号: TMS320C54V90
    百芯编号: CM435546710
    制造商: TI
    价格
    总计: 390
    MOQ: 1
    库存地点: 香港
    发货日期: 2025/06/18 (预期 )
  • 购买
    *由于库存数量、价格不断波动,请 联系我们 获取型号最新价格和库存。

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    TMS320C54V90 数据规格书
    TMS320C54V90 数据手册Datasheet
    86 Pages, 1540 KB
    2012/11/24
    查看
    符合标准
    类型
    描述
    RoHS标准
    RoHS Compliant
    含铅标准
    Lead Free
    产品概述
    • The TMS320C54V90 is used to implement a full-featured, high-performance modem technology, intended for use in embedded systems and similar applications. This highly integrated solution implements a complete modem using only two chips: the TMS320C54V90 DSP with on-chip RAM and ROM, and the Si3016 line-side DAA.
    • The modem can connect to a host system serially (RS-232 functionality), or as an 8-bit peripheral to the processor in a host system. The TMS320C54V90 uses a standard Digital Signal Processor (DSP) and proprietary firmware to perform all the modem signal processing, the V.42/V.42bis compression, and AT commands interpretation for modem control functions.
    • The TMS320C54V90 also uses the latest silicon DAA technology. This technology does not require a transformer and results in lower cost, lower power, and a smaller area for the DAA function.
    • For serial interface applications, an integrated UART implements the serial interface with no additional hardware.
    • Provides Two-Chip Modem Solution
    • Data Rates from 300 bps to 56 Kbps
    • Data Modulation Standards
    •    V.90, V.34, V.32bis, V.32, V.22bis, V.22, V.23,
    •    V.21 and V.23 reversible (Minitel), Bell 212, Bell 103
    • FAX Capabilities
    • ITU-T V.17, V.29, V.27ter Modulations
    • TIA/EIA 578 Class 1 Interface
    • * V.42 or MNP Class 3 and 4 Error Control and V.42bis Compression
    • * Caller ID
    • * Field-Proven Modem Algorithms Give Highest Performance, Reliability, and Compatibility
    • * Non-Volatile EEPROM Configuration Storage
    • * Worldwide Telecom Approvals
    • * Parallel Phone Support Including Parallel Phone Detection
    • * Parallel Phone Exclusion Relay Control
    • * Protected Against Surge and Overvoltage on the Telephone Line
    • * Parallel Host Port Interface Supports a Variety of Industry Standard Busses
    • * Integral Serial Interface (UART)
    • * Autobaud on Serial DTE Interface
    • * State-of-the-Art Integrated Transformerless Silicon DAA for Phone Line Interconnection
    • * Applications
    • Embedded Systems
    • Set-Top Boxes
    • Gaming Consoles
    • Internet Appliances
    • Portable Devices (PDAs, digital cameras)
    • Remote Data Collection, Point-of-Sale
    • Meter Reading, Utility Monitoring
    • * 40K x 16-Bit Dual-Access On-Chip RAM
    • * 128K x 16-Bit On-Chip ROM
    • * On-Chip Peripherals
    • Software-Programmable Wait-State Generator and Programmable Bank Switching
    • On-Chip Phase-Locked Loop (PLL) Clock Generator With Internal Oscillator or External Clock Source
    • Two Multichannel Buffered Serial Ports (McBSPs)
    • Enhanced 8-Bit Parallel Host-Port Interface (HPI8)
    • * Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions With Power-Down Modes
    • * On-Chip Scan-Based Emulation Logic, IEEE Std 1149.1 (JTAG) Boundary Scan Logic
    • * 8.5-ns Single-Cycle Fixed-Point Instruction Execution Time (117.96 MIPS) or 17-ns Instruction Execution Time (58.98 MIPS) for 3.3-V Power Supply (1.5-V Core)
    • * Available in a 144-Pin Plastic Low-Profile Quad Flatpack (LQFP) (PGE Suffix) and a 144-Pin Ball Grid Array (BGA) (GGU Suffix)
    • **Note:** Human Body Model ESD test performance for this product was demonstrated to be ±1.5 kV during product qualification. Industry standard test method used was IEA/JESD22-A114. Adherence to ESD handling precautionary procedures is advised at all times.
    • All trademarks are the property of their respective owners.
    • IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.

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