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TLK1501IRCP 库存 & 价格

TI Ethernet Controller, 1.5Gbps, 2.3V, 2.7V, 64Pins
162.83
TLK1501IRCP
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TLK1501IRCP TI
TI
  • 制造商:
    TI
  • 制造商型号#:
    TLK1501IRCP
  • 百芯编号#:
    CM8900800
  • 价格(CNY):
    162.83
  • 百芯库存:
    271
  • 可供应量:
    188 个在库
    此为供应商库存,需要与销售确认
  • 产品类别:
    接口,芯片
  • 产品描述:
    Ethernet Controller, 1.5Gbps, 2.3V, 2.7V, 64Pins
  • 文档: 3D模型
TLK1501IRCP 购买 TLK1501IRCP 库存和价格更新于 2025-06-11 03:50:22
  • 刷新
    器件型号: TLK1501IRCP
    百芯编号: CM8900800
    制造商: TI
    封装: VFQFP-64
    价格
    162.83
    总计: 459
    MOQ: 1
    库存地点: 香港
    发货日期: 2025/06/16 (预期 )
  • 购买
    *由于库存数量、价格不断波动,请 联系我们 获取型号最新价格和库存。

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    TLK1501IRCP 规格 显示相似产品 (99+)
    类型
    描述
    选择
    制造商
    TI
    类别
    接口,芯片
    3D模型
     3D模型
    安装方式
    Surface Mount
    引脚数
    64 Pin
    封装
    VFQFP-64
    电源电压(DC)
    2.50 V
    输出接口数
    1 Output
    供电电流
    100 mA
    电路数
    1 Circuit
    通道数
    1 Channel
    耗散功率
    2890 mW
    数据速率
    1.50 Gbps
    输入数
    16, 1 Input
    工作温度(Max)
    85 ℃
    工作温度(Min)
    -40 ℃
    耗散功率(Max)
    2890 mW
    电源电压
    2.3V ~ 2.7V
    电源电压(Max)
    2.7 V
    电源电压(Min)
    2.3 V
    显示相似产品
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    尺寸 & 包装
    类型
    描述
    长度
    10 mm
    宽度
    10 mm
    高度
    0.8 mm
    工作温度
    -40℃ ~ 85℃ (TA)
    产品生命周期
    Active
    包装方式
    Tray
    符合标准
    类型
    描述
    RoHS标准
    RoHS Compliant
    含铅标准
    Lead Free
    REACH SVHC标准
    No SVHC
    REACH SVHC版本
    2015/06/15
    出口分类
    类型
    描述
    ECCN代码
    5A991.b.1
    香港进出口证
    NLR
    产品概述
    • The TLK1501 is a member of the transceiver family of multigigabit transceivers used in ultrahigh-speed bidirectional point-to-point data transmission systems. The TLK1501 supports an effective serial interface speed of 0.6 Gbps to 1.5 Gbps, providing up to 1.2 Gbps of data bandwidth. The TLK1501 is pin-for-pin compatible with the TLK2500. The TLK1501 is both pin-for-pin compatible with and functionally identical to the TLK2501, a 1.6 to 2.5 Gbps transceiver, and the TLK3101, a 2.5 to 3.125 Gbps transceiver, providing a wide range of performance solutions with no required board layout changes.
    • The primary application of this chip is to provide very high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50 . The transmission media can be printed-circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.
    • This device can also be used to replace parallel data transmission architectures by providing a reduction in the number of traces, connector terminals, and transmit/receive terminals. Parallel data loaded into the transmitter is delivered to the receiver over a serial channel, which can be a coaxial copper cable, a controlled impedance backplane, or an optical link. It is then reconstructed into its original parallel format. It offers significant power and cost savings over current solutions, as well as scalability for higher data rate in the future.
    • The TLK1501 performs data conversion parallel-to-serial and serial-to-parallel. The clock extraction functions as a physical layer interface device. The serial transceiver interface operates at a maximum speed of 1.5 Gbps. The transmitter latches 16-bit parallel data at a rate based on the supplied reference clock (GTX_CLK). The 16-bit parallel data is internally encoded into 20 bits using an 8-bit/10-bit (8B/10B) encoding format. The resulting 20-bit word is then transmitted differentially at 20 times the reference clock (GTX_CLK) rate. The receiver section performs the serial-to-parallel conversion on the input data, synchronizing the resulting 20-bit wide parallel data to the extracted reference clock (RX_CLK). It then decodes the 20 bit wide data using 8-bit/10-bit decoding format resulting in 16 bits of parallel data at the receive data terminals (RXD0-15). The outcome is an effective data payload of 480 Mbps to 1.2 Gbps (16 bits data x the GTX_CLK frequency).
    • The TLK1501 is housed in a high performance, thermally enhanced, 64-pin VQFP PowerPAD package. Use of the PowerPAD package does not require any special considerations except to note that the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is recommended that the TLK1501 PowerPAD be soldered to the thermal land on the board. All ac performance specifications in this data sheet are measured with the PowerPAD soldered to the test board.
    • The TLK1501 provides an internal loopback capability for self-test purposes. Serial data from the serializer is passed directly to the deserializer, allowing the protocol device a functional self-check of the physical interface.
    • The TLK1501 is designed to be hot plug capable. An on-chip power-on reset circuit holds the RX_CLK low during power up. This circuit also holds the parallel side output signal terminals during power up as well as DOUTTXP and DOUTTXN in a high-impedance state.
    • The TLK1501 has a loss of signal detection circuit for conditions where the incoming signal no longer has a sufficient voltage amplitude to keep the clock recovery circuit in lock.
    • To prevent a data bit error from causing a valid data packet from being interpreted as a comma and thus causing the erroneous word alignment by the comma detection circuit, the comma word alignment circuit is turned off after the link is properly established in TLK1501.
    • The TLK1501 allows users to implement redundant ports by connecting receive data bus terminals from two TLK1501 devices together. Asserting the LCKREFN to a low state causes the receive data bus terminals, RXD[0:15], RX_CLK and RX_ER, RX_DV/LOS to go to a high-impedance state. This places the device in a transmit-only mode, since the receiver is not tracking the data.
    • The TLK1501 uses a 2.5-V supply. The I/O section is 3 V compatible. With the 2.5-V supply the chipset is very power-efficient, consuming less than 360 mW typically. The TLK1501 is characterized for operation from –40°C to 85°C.

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