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SN74GTLP1395 库存 & 价格

TI Two 1Bit LVTTL/GTLP Adj-Edge-Rate Bus Xcvrs w Split LVTTL Port Fdbk Path and Selectable Polarity
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SN74GTLP1395 TI
TI
  • 制造商:
    TI
  • 制造商型号#:
    SN74GTLP1395
  • 百芯编号#:
    CM550303022
  • 价格(CNY):
  • 百芯库存:
    254
  • 可供应量:
    174 个在库
    此为供应商库存,需要与销售确认
  • 产品描述:
    Two 1Bit LVTTL/GTLP Adj-Edge-Rate Bus Xcvrs w Split LVTTL Port Fdbk Path and Selectable Polarity
  • 文档: 符合 RoHS 标准 3D模型
SN74GTLP1395 购买 SN74GTLP1395 库存和价格更新于 2025-06-13 03:50:22
  • 刷新
    器件型号: SN74GTLP1395
    百芯编号: CM550303022
    制造商: TI
    价格
    总计: 428
    MOQ: 1
    库存地点: 香港
    发货日期: 2025/06/18 (预期 )
  • 购买
    *由于库存数量、价格不断波动,请 联系我们 获取型号最新价格和库存。

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    SN74GTLP1395 数据规格书
    SN74GTLP1395 数据手册Datasheet
    25 Pages, 1170 KB
    2016/09/12
    查看
    符合标准
    类型
    描述
    RoHS标准
    RoHS Compliant
    含铅标准
    Lead Free
    产品概述
    • The SN74GTLP1395 is two 1-bit, high-drive, 3-wire bus transceivers that provide LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation for applications, such as primary and secondary clocks, that require individual output-enable and true/complement controls. The device allows for transparent and inverted transparent modes of data transfer with separate LVTTL input and LVTTL output pins, which provide a feedback path for control and diagnostics monitoring. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels and is designed especially to work with the Texas Instruments 3.3-V 1394 backplane physical-layer controller. High-speed (about three times faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuitry minimizes bus settling time, and have been designed and tested using several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes, with equivalent load impedance down to 11 .
    • GTLP is the Texas Instruments derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP1395 is given only at the preferred higher noise margin GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and VREF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels. For information on using GTLP devices in FB+/BTL applications, refer to TI application reports, _Texas Instruments GTLP Frequently Asked Questions_, literature number SCEA019, and _GTLP in BTL Applications_, literature number SCEA017.
    • Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels, but are 5-V tolerant and are compatible with TTL or 5-V CMOS devices. VREF is the B-port differential input reference voltage.
    • This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.
    • This GTLP device features TI-OPC circuitry, which actively limits the overshoot caused by improperly terminated backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal integrity, which allows adequate noise margin to be maintained at higher frequencies.
    • High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC input voltage between low and high adjusts the B-port output rise and fall times.This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load.
    • When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
    • TI-OPC™ Circuitry Limits Ringing on Unevenly Loaded Backplanes
    • OEC™ Circuity Improves Signal Itegrity and Reduces Electromagnetic Interference
    • Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
    • Split LVTTL Port Provides a Feedback Path for Control and Diagnostics Monitoring
    • LVTTL Interfaces Are 5-V Tolerant
    • High-Drive GTLP Outputs (100 mA)
    • LVTTL Outputs (–24 mA/24 mA)
    • Variable Edge-Rate Control (ERC) Input Selects GTLP Rise and Fall Times for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
    • Ioff, Power-Up 3-State, and BIAS VCC Support Live Insertion
    • Polarity Control Selects True or Complementary Outputs
    • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
    • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
    • OEC and TI-OPC are trademarks of Texas Instruments.

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