This device is designed for cell phone applications requiring Headset and Speaker Phone, EMI Filtering and ESD Protection. This device offers an intergrated solution in a small package reducing PCB space and cost.
Features
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Provides EMI Filtering and ESD Protection
Single IC Offers Cost Saving by Replacing 2 Inductors, 4 Capacitors, and 4 TVs diodes
Compliance with IEC61000-4-2, (Level 4) 8kV (Contact), 15kV (air)
Flip-Chip Package
Moisture Sensitivity Level 1
ESD Ratings: Machine Model = C, Human Body Model = 3B