* Package: white SMT package, colorless clear resin * Feature of the device: radiation direction parallel to PCB, so an ideal LED for coupling in light guides * Wavelength: 630 nm (super-red) * Viewing angle: Lambertian Emitter (120°) * Technology: InGaAlP * Optical efficiency: 5 lm/W (super-red) * Grouping parameter: luminous intensity, wavelength * Assembly methods: suitable for all SMT assembly methods * Soldering methods: reflow soldering * Preconditioning: acc. to JEDEC Level 2 * Taping: 12 mm tape with 2000/reel, ø330 mm * ESD-withstand voltage: up to 2 kV acc. to JESD22-A114-D * Superior Corrosion Robustness: