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LPC43S57JET256E 库存 & 价格

NXP 32Bit ARM Cortex-M4/M0 MCU; 1Mb flash and 136KB SRAM; Ethernet, 2 x USB, LCD, EMC, AES engine
250.66
LPC43S57JET256E
显示的图像仅供参考,应从产品数据表中获得准确的规格。
LPC43S57JET256E NXP
NXP
  • 制造商:
    NXP
  • 制造商型号#:
    LPC43S57JET256E
  • 百芯编号#:
    CM60724208
  • 价格(CNY):
    250.66
  • 百芯库存:
    304
  • 库存地点: 香港
  • 可供应量:
    221 个在库
    此为供应商库存,需要与销售确认
  • 产品类别:
    微控制器,MCU,单片机
  • 产品描述:
    32Bit ARM Cortex-M4/M0 MCU; 1Mb flash and 136KB SRAM; Ethernet, 2 x USB, LCD, EMC, AES engine
  • 文档: 3D模型
LPC43S57JET256E 购买 LPC43S57JET256E 库存和价格更新于 2025-06-06 03:50:22
  • 刷新
    器件型号: LPC43S57JET256E
    百芯编号: CM60724208
    制造商: NXP
    封装: LBGA-256
    价格
    250.66
    总计: 525
    MOQ: 1
    库存地点: 香港
    发货日期: 2025/06/11 (预期 )
  • 购买
    *由于库存数量、价格不断波动,请 联系我们 获取型号最新价格和库存。

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    LPC43S57JET256E 规格 显示相似产品 (99+)
    类型
    描述
    选择
    制造商
    NXP
    类别
    微控制器,MCU,单片机
    3D模型
     3D模型
    引脚数
    256 Pin
    封装
    LBGA-256
    电源电压(DC)
    2.60V (min)
    针脚数
    256 Position
    时钟频率
    204 MHz
    RAM大小
    136 KB
    位数
    32 Bit
    耗散功率
    1500 mW
    FLASH内存容量
    1024 kB
    模数转换数(ADC)
    2 ADC
    输入/输出数
    164 Input IO
    工作温度(Max)
    105 ℃
    工作温度(Min)
    -40 ℃
    耗散功率(Max)
    1500 mW
    数模转换数(DAC)
    1 DAC
    电源电压
    2.4V ~ 3.6V
    电源电压(Max)
    3.4 V
    电源电压(Min)
    2.6 V
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    尺寸 & 包装
    类型
    描述
    重量
    743.44102583 mg
    工作温度
    -40℃ ~ 105℃
    产品生命周期
    Pre-Release
    包装方式
    Tray
    符合标准
    类型
    描述
    RoHS标准
    RoHS Compliant
    含铅标准
    Lead Free
    REACH SVHC版本
    2015/12/17
    产品概述
    • Overview
    • The LPC43S57JET256 is a ARM Cortex-M4 based microcontroller for embedded applications which includes an ARM Cortex-M0 coprocessor, 1 MB of flash and 136 kB of on-chip SRAM, 16 kB of EEPROM memory, security features with AES engine, a quad SPI Flash Interface (SPIFI), advanced configurable peripherals such as the State Configurable Timer (SCT) and the Serial General Purpose I/O (SGPIO) interface, two High-speed USB controllers, Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals. The LPC43S57JET256 operates at CPU frequencies of up to 204 MHz.
    • The ARM Cortex-M4 is a 32-bit core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals, and includes an internal prefetch unit that supports speculative branching. The ARM Cortex-M4 supports single-cycle digital signal processing and SIMD instructions. A hardware floating-point unit is integrated in the core. The ARM Cortex-M4 with floating-point unit is often referred to as M4F.
    • The ARM Cortex-M0 coprocessor is an energy-efficient and easy-to-use 32-bit core which is upward code- and tool-compatible with the Cortex-M4 core. The Cortex-M0 coprocessor, designed as a replacement for existing 8/16-bit microcontrollers, offers up to 204 MHz performance with a simple instruction set and reduced code size.
    • MoreLess
    • ## Features
    • * Cortex-M4 Processor core
    • * ARM Cortex-M4 processor (version r0p1), running at frequencies of up to 204 MHz.
    • * Built-in Memory Protection Unit (MPU) supporting eight regions.
    • * Built-in Nested Vectored Interrupt Controller (NVIC).
    • * Hardware floating-point unit.
    • * Non-maskable Interrupt (NMI) input.
    • * JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four watch points.
    • * Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support.
    • * System tick timer.
    • * Cortex-M0 Processor core
    • * ARM Cortex-M0 coprocessor (version r0p0) capable of off-loading the main ARM Cortex-M4 application processor.
    • * Running at frequencies of up to 204 MHz.
    • * JTAG
    • * Built-in NVIC.
    • * On-chip memory
    • * 1 MB on-chip dual bank flash memory with flash accelerator.
    • * 16 kB on-chip EEPROM data memory.
    • * 136 kB SRAM for code and data use.
    • * Multiple SRAM blocks with separate bus access. Two SRAM blocks can be powered down individually.
    • * 64 kB ROM containing boot code and on-chip software drivers.
    • * 64 bit of One-Time Programmable (OTP) memory for general-purpose use.
    • * Two banks (256 bit total) One-Time Programmable (OTP) memory for AES key storage. One bank can store an encrypted key for decoding the boot image.
    • * AES engine for encryption and decryption of the boot image and data with DMA support and programmable via a ROM-based API.
    • * Configurable digital peripherals
    • * Serial GPIO (SGPIO) interface.
    • * State Configurable Timer (SCT) subsystem on AHB.
    • * Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs and outputs to event driven peripherals like the timers, SCT, and ADC0/1.
    • * Serial interfaces
    • * Quad SPI Flash Interface (SPIFI) with four lanes and up to 52 MB per second.
    • * 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for high throughput at low CPU load. Support for IEEE 1588 time stamping/advanced time stamping (IEEE 1588-2008 v2).
    • * One High-speed USB 2.0 Host/Device interface with DMA support, on-chip full-speed PHY and ULPI interface to external high-speed PHY
    • * USB interface electrical test software included in ROM USB stack.
    • * One 550 UART with DMA support and full modem interface.
    • * Three 550 USARTs with DMA and synchronous mode support and a smart card interface conforming to ISO7816 specification. One USART with IrDA interface.
    • * Up to two C_CAN 2.0B controllers with one channel each.
    • * Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMA support.
    • * One SPI controller.
    • * One Fast-mode Plus I²C-bus interface with monitor mode and with open-drain I/O pins conforming to the full I²C-bus specification. Supports data rates of up to 1 Mbit/s.
    • * One standard I²C-bus interface with monitor mode and with standard I/O pins.
    • * Two I²S interfaces, each with DMA support and with one input and one output.
    • * Digital peripherals
    • * External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash, and SDRAM devices.
    • * LCD controller with DMA support and a programmable display resolution of up to 1024 H x 768 V. Supports monochrome and color STN panels and TFT color panels; supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixel mapping. Available on parts LPC4357/53 only.
    • * Secure Digital Input Output (SD/MMC) card interface.
    • * Eight-channel General-Purpose DMA controller can access all memories on the AHB and all DMA-capable AHB slaves.
    • * Up to 164 General-Purpose Input/Output (GPIO) pins with configurable pull-up/pull-down resistors.
    • * GPIO registers are located on the AHB for fast access. GPIO ports have DMA support.
    • * Up to eight GPIO pins can be selected from all GPIO pins as edge and level sensitive interrupt sources.
    • * Two GPIO group interrupt modules enable an interrupt based on a programmable pattern of input states of a group of GPIO pins.
    • * Four general-purpose timer/counters with capture and match capabilities.
    • * One motor control Pulse Width Modulator (PWM) for three-phase motor control.
    • * One Quadrature Encoder Interface (QEI).
    • * Repetitive Interrupt timer (RI timer).
    • * Windowed watchdog timer (WWDT).
    • * Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytes of battery powered backup registers.
    • * Alarm timer; can be battery powered.
    • * Analog peripherals
    • * One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s.
    • * Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s. Up to eight input channels per ADC.
    • * Unique ID for each device.
    • * Clock generation unit
    • * Crystal oscillator with an operating range of 1 MHz to 25 MHz.
    • * 12 MHz internal RC oscillator trimmed to 3 % accuracy over temperature and voltage (1.5 % accuracy for Tamb = 0 °C to 85 °C).
    • * Ultra-low power Real-Time Clock (RTC) crystal oscillator.
    • * Three PLLs allow CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. The second PLL can be used with the High-speed USB, the third PLL can be used as audio PLL.
    • * Clock output.
    • * Power
    • * Single 3.3 V (2.4 V to 3.6 V) power supply with on-chip DC-to-DC converter for the core supply and the RTC power domain.
    • * RTC power domain can be powered separately by a 3 V battery supply.
    • * Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down.
    • * Processor wake-up from Sleep mode via wake-up interrupts from various peripherals.
    • * Wake-up from Deep-sleep, Power-down, and Deep power-down modes via external interrupts and interrupts generated by battery powered blocks in the RTC power domain.
    • * Brownout detect with four separate thresholds for interrupt and forced reset.
    • * Power-On Reset (POR).
    • * Available as LBGA256 package.
    • ## Target Applications
    • * Secure industrial gateways
    • * Automotive aftermarket, including telematics
    • * Smart meters
    • * Industrial controls
    • * Industrial automation
    • * Diagnostic equipment
    • * White goods HMI
    • * Data collectors and navigation
    • * Electronic instruments
    • ## Features
    • * Electronic instruments

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