The LDC1314EVM is an Evaluation Module demonstrates the use of inductive sensing technology to sense and measure the presence, position or composition of a conductive target object. The module includes two example PCB sensor coils but can connect to the four channels of the LDC1314. An MSP430 MCU is used to interface the LDC to a host computer.
Multiple board perforations - provide maximum evaluation and system design flexibility
Includes example sensor coils for the different channels
Operates via PC
Accompanying GUI for quick concept demonstration and data capture
EVM design accelerates prototyping of end application
