百芯的价格

TPS82740BSIPT 产品设计参考 - TI

制造商:
TI
分类:
DCDC,转换器,DC-DC
封装
BGA-9
描述:
Non Isolated Board Mount DC-DC Converter, Micro SIP, 2.6V, 3.3V, 200mA, 2.2V
页面指南:
功能框图在 7页 15页 16页 17页 18页

应用领域在 30页 31页

更新时间： 2025-06-14 16:17:34 (UTC+8)

TPS82740BSIPT 产品设计参考

页码:/31页

重新加载

MSP-EXP430G2 LaunchPad Experimenter

Board

User's Guide

Literature Number: SLAU318C

July 2010–Revised August 2012

页面指南

页面指南

点击重新加载修复错误页面>

TPS82740BSIPT 数据手册 PDF

TPS82740BSIPT 数据手册

30 页, 3070 KB

TPS82740BSIPT 产品设计参考

31 页, 810 KB

Non Isolated Board Mount DC-DC Converter, Micro SIP, 2.6V, 3.3V, 200mA, 2.2V

Non Isolated Board Mount DC-DC Converter, Micro SIP, 1.8V, 2.5V, 200mA, 2.2V

Module DC-DC 1Out 2.6V to 3.3V 0.2A 9Pin uSIP T/R

Module DC-DC 1Out 1.8V to 2.5V 0.2A 9Pin uSIP T/R

TPS82740A DC to DC Converter and Switching Regulator Module 1.8VDC to 2.5VDC Output Evaluation Board

TPS82740B DC to DC Converter and Switching Regulator Chip 2.6VDC to 3.3VDC Output Evaluation Board

200mA Step Down Converter MicroSiP Module with 360nA quiescent current 9-uSiP -40℃ to 85℃

200mA Step Down Converter MicroSiP Module with 360nA quiescent current 9-uSiP -40℃ to 85℃

Datasheet 搜索

搜索

百芯智造数据库涵盖1亿多个数据手册，每天更新超过5,000个PDF文件。