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TPS70145PWP
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TPS70145PWP 产品设计参考 - TI

更新时间: 2025-06-15 07:21:28 (UTC+8)

TPS70145PWP 产品设计参考

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User's Guide
SLVU303 April 2009
TPS54362EVM
Contents
1 Introduction ................................................................................................................... 2
2 Setup .......................................................................................................................... 2
2.1 Input/Output Connector Description .............................................................................. 2
2.2 Setup ................................................................................................................. 3
2.3 Operation ............................................................................................................ 3
3 Board Layout ................................................................................................................. 4
4 Schematic and Bill of Materials ............................................................................................ 6
4.1 Schematic ............................................................................................................ 6
4.2 Bill of Materials ...................................................................................................... 7
List of Figures
1 LPM Jumper Settings ....................................................................................................... 2
2 Enable Jumper Settings..................................................................................................... 3
3 Slew Rate Settings .......................................................................................................... 3
4 Reset Delay Time Settings ................................................................................................. 3
5 Top Assembly Layer ......................................................................................................... 4
6 Top Layer Routing ........................................................................................................... 5
7 Bottom Layer Routing ....................................................................................................... 5
8 TPS54362EVM Schematic ................................................................................................. 6
List of Tables
1 Device and Package Configurations ...................................................................................... 2
2 TPS54362EVM Bill of Materials for 500 kHz Configuration ............................................................ 7
3 TPS54362EVM Bill of Materials for 2 MHz Configuration .............................................................. 8
PowerPAD is a trademark of Texas Instruments.
SLVU303 April 2009 TPS54362EVM 1
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