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TMS320C6712DZDP150 产品设计参考 - TI

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TMS320C6712DZDP150 产品设计参考

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TMS320C6712D
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
SPRS293B -- OCTOBER 2005 -- REVISED JUNE 2006
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251--1443
D Low-Price/High-Performance Floating-Point
Digital Signal Processor (DSP):
TMS320C6712D
-- Eight 32-Bit Instructions/Cycle
-- 150-MHz Clock Rate
-- 6.7-ns Instruction Cycle Time
-- 900 MFLOPS
D Advanced Very Long Instruction Word
(VLIW) C67x DSP Core
-- Eight Highly Independent Functional
Units:
-- Four ALUs (Floating- and Fixed-Point)
-- Two ALUs (Fixed-Point)
-- Two Multipliers (Floating- and
Fixed-Point)
-- Load-Store Architecture With 32 32-Bit
General-Purpose Registers
-- Instruction Packing Reduces Code Size
-- All Instructions Conditional
D Instruction Set Features
-- Hardware Support for IEEE
Single-Precision and Double-Precision
Instructions
-- Byte-Addressable (8-, 16-, 32-Bit Data)
-- 8-Bit Overflow Protection
-- Saturation
-- Bit-Field Extract, Set, Clear
-- Bit-Counting
-- Normalization
D L1/L2 Memory Architecture
-- 32K-Bit (4K-Byte) L1P Program Cache
(Direct Mapped)
-- 32K-Bit (4K-Byte) L1D Data Cache
(2-Way Set-Associative)
-- 512K-Bit (64K-Byte) L2 Unified Mapped
RAM/Cache
(Flexible Data/Program Allocation)
D Device Configuration
-- Boot Mode: 8- and 16-Bit ROM Boot
-- Little Endian, Big Endian
D Enhanced Direct-Memory-Access (EDMA)
Controller (16 Independent Channels)
D 16-Bit External Memory Interface (EMIF)
-- Glueless Interface to Asynchronous
Memories: SRAM and EPROM
-- Glueless Interface to Synchronous
Memories: SDRAM and SBSRAM
-- 256M-Byte Total Addressable External
Memory Space
D Two Multichannel Buffered Serial Ports
(McBSPs)
-- Direct Interface to T1/E1, MVIP, SCSA
Framers
-- ST-Bus-Switching Compatible
-- Up to 256 Channels Each
-- AC97-Compatible
-- Serial-Peripheral-Interface (SPI)
Compatible (Motorola)
D Two 32-Bit General-Purpose Timers
D Flexible Software-Configurable PLL-Based
Clock Generator Module
D A Dedicated General-Purpose Input/Output
(GPIO) Module With 5 Pins
D IEEE-1149.1 (JTAG
)
Boundary-Scan-Compatible
D 272-Pin Ball Grid Array (BGA) Package
(GDP and ZDP Suffix)
D CMOS Technology
-- 0.13-m/6-Level Copper Metal Process
D 3.3-V I/Os, 1.20
-V Internal
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2006, Texas Instruments Incorporated
TMS320C67x and C67x are trademarks of Texas Instruments.
Motorola is a trademark of Motorola, Inc.
All trademarks are the property of their respective owners.
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
These values are compatible with existing 1.26V designs.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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