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June 2015
DocID023971 Rev 4
1/12
www.st.com
AN4211
Application note
Guidelines for soldering MEMS microphones
By Alessandro Morcelli
Introduction
This application note provides guidelines and recommendations for soldering MEMS microphones on
application boards. Microphones, as pressure sensors, sense the mechanical stress coming from the
PCB, hence this force should be kept to a minimum. Printing and stencil parameters, followed by device
footprints/recommended land patterns, stencil openings, and process considerations are presented in
this document.
The following guidelines have been developed for the MEMS microphone family (MP45DT02/-M,
MP34DB01, MP34DT01/-M, MP33AB01/H, MP34DB02, and MP23AB02B) offered by
STMicroelectronics.
Demonstration boards (STEVAL-MKI129Vx) for the evaluation and promotion of the MP45DT02,
MP34DT01, and MP34DT01 are also available. Please refer to AN4184 "Microphone coupon boards
STEVAL-MKI129Vx based on the MP45DT02, MP34DB01, and MP34DT01" on www.st.com for further
information.
Figure 1: Mechanical specifications for soldering
