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5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
X
Y
aaa Z
aaa Z
PACKAGE BOTTOM VIEW
3
SEE NOTES
SUGGESTED PCB LAYOUT
TOP VIEW
BGA 32 1112 REV D
LTMXXXXXX
µModule
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
DETAIL A
PIN 1
0.000
0.635
0.635
1.905
1.905
3.175
3.175
4.445
4.445
6.350
6.350
5.080
5.080
0.000
DETAIL A
Øb (32 PLACES)
F
G
H
L
J
K
E
A
B
C
D
2 14 35678
DETAIL B
SUBSTRATE
0.27 – 0.37
2.45 – 2.55
// bbb Z
D
A
A1
b1
ccc Z
DETAIL B
PACKAGE SIDE VIEW
MOLD
CAP
Z
M
X YZddd
M
Zeee
0.630 ±0.025 Ø 32x
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
3.22
0.50
2.72
0.60
0.60
NOM
3.42
0.60
2.82
0.75
0.63
15.0
11.25
1.27
12.70
8.89
MAX
3.62
0.70
2.92
0.90
0.66
0.15
0.10
0.20
0.30
0.15
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 32
E
b
e
e
b
A2
F
G
BGA Package
32-Lead (15mm × 11.25mm × 3.42mm)
(Reference LTC DWG # 05-08-1851 Rev D)
7
SEE NOTES
