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March 2014 DocID12707 Rev 5 1/9
TN0018
Technical note
Surface mounting guidelines for MEMS sensors
in an LGA package
Introduction
This technical note provides general guidelines for soldering MEMS sensor products
housed in an LGA surface-mount package.
Note: Information provided in this document is to be intended for use as reference material
concerning PCB design and soldering processes. For device specifications, refer to the
corresponding datasheet.
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