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SKYPER 32 R
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SKYPER 32 R 应用笔记 - Semikron

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SKYPER 32 R 应用笔记

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Board 2s SKYPER™ 32PRO - Technical Explanations
1 / 11 2005-06-08 – Rev02
© by SEMIKRON
Evaluation Board 2s SKYPER™ 32PRO
Technical Explanations
Revision 02
Status: evaluation board
--------------------------------------------------------------------------------------------------------------------------------------------------------------------------
This Technical Explanation is valid for the following parts:
part number type date code (YYWW)
L6100240 Board 2s SKYPER™ 32PRO 0522
Related documents:
title version
Technical Explanations SKYPER™ 32PRO Rev02
Prepared by: Markus Hermwille
--------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Content
Disclaimer................................................................................................................................................................ 2
Application and Handling Instructions...................................................................................................................... 3
Further application support...................................................................................................................................... 3
General Description................................................................................................................................................. 3
Dimensions.............................................................................................................................................................. 4
Component Placement Layout ................................................................................................................................ 4
PIN Array (not SKiiP® compatible).......................................................................................................................... 5
Signal IF_CMN_nHALT ........................................................................................................................................... 6
Setting Dead Time................................................................................................................................................... 6
Setting Dynamic Short Circuit Protection................................................................................................................. 6
Collector Series Resistance..................................................................................................................................... 7
Adaptation Gate Resistors....................................................................................................................................... 7
Setting Soft Turn-Off................................................................................................................................................ 7
Temperature Signal................................................................................................................................................. 7
Over Temperature Protection Circuit (OTP) ............................................................................................................ 8
Mounting Notes ....................................................................................................................................................... 8
Schematics.............................................................................................................................................................. 9
Layouts.................................................................................................................................................................. 11
Parts List ............................................................................................................................................................... 11
Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is
given and no liability is assumed with respect to the accuracy or use of such information. Furthermore, this technical
information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or
implied is made regarding delivery, performance or suitability. Specifications mentioned in this document are subject to
change without notice. This document supersedes and replaces all information previously supplied and may be supersede
by updates.
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