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November 2009 Doc ID 7604 Rev 3 1/20
AN1294
Application note
PowerSO-10RF: the first true RF power SMD package
Introduction
During the last years, as the size of electronic components has decreased and their
reliability increased, there has been a need across the board for various surface-mounted
components. The PowerSO-10RF is not just a new package, it is a new concept in a small
outline plastic package for RF power applications. Such applications have a great need for
surface-mount device (SMD) packages but, up until now, the available bipolar technology did
not allow for such types of package.
The main advantages of this new RF plastic package are excellent thermal performance,
high power capability, high power density and suitability for all reflow soldering methods.
The purpose of this application note is to demonstrate that the PowerSO-10RF is the perfect
solution for the new RF power LDMOS products recently introduced by STMicroelectronics.
www.st.com
