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Soldering Recommendations for Melexis Products
June 2008
Scope
Soldering processes are a likely source for potential stress of a semiconductor device and if
misapplied can induce latent reliability issues. This has been reconfirmed with the latest
technological and environmental developments. Those challenges, taken into account during
Melexis’ normal and customary package qualification tests, require utmost care and attention during
the soldering process applied by our customers and their contract manufacturers. This document
describes some soldering recommendations applicable to Melexis products.
For any soldering techniques deviating from the ones described below, please contact Melexis to verify
compatibility between our products and intended soldering methods.
Moisture sensitivity and Peak Temperature
For components normally soldered using Surface Mounted Device techniques (eg: reflow process), a
significant concern is related to the moisture absorption by the package body; which due to increased
water vapor pressure when exposed to soldering temperatures, could lead to reliability issues such as
delamination, package crack and bond wire fractures.
For that purpose, moisture sensitivity levels (MSL) are determined for the relevant Melexis
components, using the Jedec-020 standard. Qualified moisture sensitivity level and peak temperature
are indicated on product labels, whenever applicable.
Such components must be handled in accordance with Jedec-020 and Jedec-033 at all stages of the
supply chain prior to the soldering process.
Lead finish
Melexis Pb free lead finish plating is typically matte tin and allows for backward compatibility with
standard SnPb based solders.
Prior to using a Pb free process, please make sure that all intended components have suitable plating.
Melexis Pb free devices are processed using state-of-the-art international recommendations to
minimize “tin whisker” growth. This includes minimum plating thickness (prior to trim and form)
and a post plating bake step. Whisker growth is validated using Jedec-201 standard on a package
family basis.
