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NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6ULLIEC
Rev. 0, 09/2016
Ordering Information
See Table 1 on page 3
NXP reserves the right to change the production detail specifications as may be required to permit
improvements in the design of its products.
MCIMX6YxDxxxxxA
MCIMX6YxCxxxxxA
Package Information
Plastic Package
MAPBGA 14 x 14 mm, 0.8 mm pitch
MAPBGA 9 x 9 mm, 0.5 mm pitch
1 i.MX 6ULL Introduction
The i.MX 6ULL processors represent NXP’s latest
achievement in integrated multimedia-focused products
offering high performance processing with a high degree
of functional integration, targeted towards the growing
market of connected devices.
The i.MX 6ULL is a high performance, ultra efficient
processor family with featuring NXP’s advanced
implementation of the single ARM Cortex
®
-A7 core,
which operates at speeds of up to 528 MHz. i.MX 6ULL
includes integrated power management module that
reduces the complexity of external power supply and
simplifies the power sequencing. Each processor in this
family provides various memory interfaces, including
LPDDR2, DDR3, DDR3L, Raw and Managed NAND
flash, NOR flash, eMMC, Quad SPI, and a wide range of
other interfaces for connecting peripherals, such as
WLAN, Bluetooth™, GPS, displays, and camera
sensors.
i.MX 6ULL Applications
Processors for Industrial
Products
1. i.MX 6ULL Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17
3.2. Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 20
4.2. Power Supplies Requirements and Restrictions . 30
4.3. Integrated LDO Voltage Regulator Parameters . . 31
4.4. PLL’s Electrical Characteristics . . . . . . . . . . . . . . . 33
4.5. On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . 34
4.6. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 35
4.7. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 39
4.8. Output Buffer Impedance Parameters . . . . . . . . . 42
4.9. System Modules Timing . . . . . . . . . . . . . . . . . . . . 44
4.10. General-Purpose Media Interface (GPMI) Timing 61
4.11. External Peripheral Interface Parameters . . . . . . . 69
4.12. A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 105
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 105
5.2. Boot Device Interface Allocation . . . . . . . . . . . . . 106
6. Package Information and Contact Assignments . . . . . 113
6.1. 14 x 14 mm Package Information . . . . . . . . . . . . 113
6.2. 9x9 mm Package Information . . . . . . . . . . . . . . . 126
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
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