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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX6SXCEC
Rev. 1, 9/2015
MCIMX6XxExxxxxB
Package Information
Plastic Package
BGA 19 x 19 mm, 0.8 mm pitch
BGA 17 x 17 mm, 0.8 mm pitch
BGA 14 x 14 mm, 0.65 mm pitch
Ordering Information
See Table 1 on page 3
© 2015 Freescale Semiconductor, Inc. All rights reserved.
1 i.MX 6SoloX Introduction
The i.MX 6SoloX processors represent Freescale
Semiconductor’s latest achievement in integrated
multimedia-focused products offering high performance
processing with a high degree of functional integration,
targeted towards the growing market of connected
devices.
The i.MX 6SoloX processor features Freescale’s
advanced implementation of the single ARM®
Cortex®-A9 core, which operates at speeds of up to 1
GHz, in addition to the ARM Cortex-M4 core, which
operates at speeds of up to 227 MHz. This type of
heterogeneous multicore architecture provides greater
levels of system integration, smart low-power system
awareness, and fast real-time responsiveness. The i.MX
6SoloX includes a GPU processor capable of supporting
2D and 3D operations, a wide range of display and
connectivity options, and integrated power management.
i.MX 6SoloX Applications
Processors for Consumer
Products
1 i.MX 6SoloX Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
2 Architectural Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
3 Modules List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3.1 Special Signal Considerations . . . . . . . . . . . . . . . . . .19
3.2 Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .22
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . . .22
4.2 Power Supplies Requirements and Restrictions . . . .34
4.3 Integrated LDO Voltage Regulator Parameters . . . . .35
4.4 PLL’s Electrical Characteristics . . . . . . . . . . . . . . . . .37
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . .38
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . .39
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . .44
4.8 Output Buffer Impedance Parameters . . . . . . . . . . . .48
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . . .52
4.10General-Purpose Media Interface (GPMI) Timing. . .70
4.11External Peripheral Interface Parameters . . . . . . . . .78
4.12A/D converter and Video A/D converters . . . . . . . .120
5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . . .127
5.1 Boot Mode Configuration Pins . . . . . . . . . . . . . . . . .127
5.2 Boot Device Interface Allocation . . . . . . . . . . . . . . .129
6 Package Information and Contact Assignments . . . . . . .136
6.1 i.MX 6SoloX signal availability by package . . . . . . .136
6.2 Signals with different states during
reset and after reset . . . . . . . . . . . . . . . . . . . . . . .139
6.3 19x19 mm Package Information . . . . . . . . . . . . . . .141
6.4 17x17 mm Package Information . . . . . . . . . . . . . . .161
6.5 14x14 mm Package Information . . . . . . . . . . . . . . .196
7 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .214
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