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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX6SXAEC
Rev. 1, 9/2015
MCIMX6XxAxxxxxB
Package Information
Plastic Package
BGA 19 x 19 mm, 0.8 mm pitch
BGA 17 x 17 mm, 0.8 mm pitch
BGA 14 x 14 mm, 0.65 mm pitch
Ordering Information
See Table 1 on page 3
© 2015 Freescale Semiconductor, Inc. All rights reserved.
1 i.MX 6SoloX Introduction
The i.MX 6SoloX automotive and infotainment
processors represent Freescale Semiconductor’s latest
achievement in integrated multimedia-focused products
offering high-performance processing with a high degree
of functional integration. These processors are designed
considering the needs of the growing automotive
infotainment, telematics, HMI, and display-based cluster
markets.
The i.MX 6SoloX processor features Freescale’s
advanced implementation of the single ARM®
Cortex®-A9 core, which operates at speeds of up to 800
MHz, in addition to the ARM Cortex-M4 core, which
operates at speeds of up to 227 MHz. This type of
heterogeneous multicore architecture provides greater
levels of system integration, smart low-power system
awareness, and fast real-time responsiveness. The i.MX
6SoloX includes a GPU processor capable of supporting
i.MX 6SoloX Automotive
and Infotainment
Applications Processors
1 i.MX 6SoloX Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2 Architectural Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
3 Modules List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3.1 Special Signal Considerations . . . . . . . . . . . . . . . . . .19
3.2 Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .22
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . . .22
4.2 Power Supplies Requirements and Restrictions . . . .34
4.3 Integrated LDO Voltage Regulator Parameters . . . . .35
4.4 PLL’s Electrical Characteristics . . . . . . . . . . . . . . . . .37
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . .38
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . .39
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . .44
4.8 Output Buffer Impedance Parameters . . . . . . . . . . . .48
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . . .52
4.10General-Purpose Media Interface (GPMI) Timing. . .70
4.11External Peripheral Interface Parameters . . . . . . . . .78
4.12A/D converter and Video A/D converters . . . . . . . .123
5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . . .130
5.1 Boot Mode Configuration Pins . . . . . . . . . . . . . . . . .130
5.2 Boot Device Interface Allocation . . . . . . . . . . . . . . .132
6 Package Information and Contact Assignments . . . . . . .139
6.1 i.MX 6SoloX signal availability by package . . . . . . .139
6.2 Signals with different states during reset and
after reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .142
6.3 19x19 mm Package Information . . . . . . . . . . . . . . .144
6.4 17x17 mm Package Information . . . . . . . . . . . . . . .164
6.5 14x14 mm Package Information . . . . . . . . . . . . . . .199
7 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .217
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