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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX6SXIEC
Rev. 1, 9/2015
MCIMX6XxCxxxxxB
Package Information
Plastic Package
BGA 19 x 19 mm, 0.8 mm pitch
BGA 17 x 17 mm, 0.8 mm pitch
BGA 14 x 14 mm, 0.65 mm pitch
Ordering Information
See Table 1 on page 3
© 2015 Freescale Semiconductor, Inc. All rights reserved.
1 i.MX 6SoloX Introduction
The i.MX 6SoloX processors represent Freescale
Semiconductor's latest achievement in integrated
multimedia-focused products offering high-performance
processing with a high degree of functional integration to
meet the demands of high-end, advanced industrial and
medical applications requiring graphically rich and
highly responsive user interfaces.
The i.MX 6SoloX processor features Freescale’s
advanced implementation of the single ARM®
Cortex®-A9 core, which operates at speeds of up to 800
MHz, in addition to the ARM Cortex-M4 core, which
operates at speeds of up to 227 MHz. This type of
heterogeneous multicore architecture provides greater
levels of system integration, smart low-power system
awareness, and fast real-time responsiveness. The i.MX
6SoloX includes a GPU processor capable of supporting
2D and 3D operations, a wide range of display and
i.MX 6SoloX Applications
Processors for Industrial
Products
1 i.MX 6SoloX Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
2 Architectural Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
3 Modules List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3.1 Special Signal Considerations . . . . . . . . . . . . . . . . . .19
3.2 Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .22
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . . .22
4.2 Power Supplies Requirements and Restrictions . . . .33
4.3 Integrated LDO Voltage Regulator Parameters . . . . .34
4.4 PLL’s Electrical Characteristics . . . . . . . . . . . . . . . . .36
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . .37
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . .38
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . .43
4.8 Output Buffer Impedance Parameters . . . . . . . . . . . .47
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . . .51
4.10General-Purpose Media Interface (GPMI) Timing. . .69
4.11External Peripheral Interface Parameters . . . . . . . . .77
4.12A/D converter and Video A/D converters . . . . . . . . 119
5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . . .126
5.1 Boot Mode Configuration Pins . . . . . . . . . . . . . . . . .126
5.2 Boot Device Interface Allocation . . . . . . . . . . . . . . .128
6 Package Information and Contact Assignments . . . . . . .135
6.1 i.MX 6SoloX signal availability by package . . . . . . .135
6.2 Signals with different states during reset
and after reset . . . . . . . . . . . . . . . . . . . . . . . . . . .138
6.3 19x19 mm Package Information . . . . . . . . . . . . . . .140
6.4 17x17 mm Package Information . . . . . . . . . . . . . . .160
6.5 14x14 mm Package Information . . . . . . . . . . . . . . .195
7 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .213
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