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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX25AEC
Rev. 8, 01/2011
MCIMX25
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Ordering Information
See Ta bl e 1 on page 3 for ordering information.
© Freescale Semiconductor, Inc., 2011. All rights reserved.
1 Introduction
The i.MX25 family of processors offers integration
that tailors itself to the connectivity requirements of
today's automobile infotainment systems. These
processors have been architected to meet auto
infotainment requirements like CAN, USB
connectivity, and audio connectivity, without many
of the extra features only needed for high-end
applications. As a result, the i.MX25 enables many
of the features only available in high-end systems,
but at a price point suitable for all vehicles.
At the core of the i.MX25 is Freescale's fast,
proven, power-efficient implementation of the
ARM926EJ-S core, with speeds of up to 400 MHz.
The i.MX25 includes support for up to 133-MHz
DDR2 memory, integrated 10/100 Ethernet MAC,
and two on-chip USB PHYs. The automotive
versions of the i.MX25 offer AEC-Q100 grade 3
qualification to meet stringent automotive quality
requirements. The device is suitable for a wide
range of applications, including the following:
• USB Connectivity for media
storage/playback, personal media device
interface, and firmware updates
i.MX25 Applications
Processor for Automotive
Products
Silicon Version 1.2
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11
3.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18
3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 19
3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20
3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 25
3.7. Module Timing and Electrical Parameters . . . . . . 42
4. Package Information and Contact Assignment . . . . . . 124
4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124
4.2. Ground, Power, Sense, and Reference Contact
Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125
4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 135
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
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