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Freescale Semiconductor
Data Sheet: Advance Information
Document Number: IMX53CEC
Rev. 4.1, 2/2012
MCIMX53xD
Package Information
Plastic Package
Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch
Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch
Ordering Information
See Table 1 on page 3
© 2012 Freescale Semiconductor, Inc. All rights reserved.
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
1 Introduction
The i.MX53xD multimedia application processor is
Freescale Semiconductor’s latest addition to a growing
family of multimedia-focused products offering high
performance processing optimized for lowest power
consumption.
The i.MX53xD processor features Freescale’s advanced
implementation of the ARM™ core, which operates at
clock speeds as high as 1.2 GHz and interfaces with
DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800
DRAM memories. This device is suitable for
applications such as the following:
•Tablets
• Smart devices
• Netbooks (web tablets)
• Nettops (Internet desktop devices)
• Thin clients
• Media phones
• Internet monitors
• High-end mobile Internet devices (MID)
i.MX53xD Applications
Processors for Consumer
Products
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17
4.2. Power Supply Requirements and Restrictions . . . 25
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 28
4.4. Output Buffer Impedance Characteristics . . . . . . 34
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 45
4.7. External Peripheral Interfaces Parameters . . . . . . 67
4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 143
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 144
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 144
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 145
5.3. Power Setup During Boot . . . . . . . . . . . . . . . . . . 146
6. Package Information and Contact Assignments . . . . . 147
6.1. 19x19 mm Package Information . . . . . . . . . . . . . 147
6.2. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 166
6.3. 12 x 12 mm Package on Package (PoP) Information
170
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
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