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© Freescale Semiconductor, Inc., 2005–2010. All rights reserved.
Freescale Semiconductor
Data Sheet: Technical Data
This document contains information on a new product. Specifications and information herein are subject to change without notice.
Document Number: MCIMX31C
Rev. 4.3, 2/2010
MCIMX31C and
MCIMX31LC
Package Information
Plastic Package
Case 1931 19 x 19 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1 Introduction
The MCIMX31C and MCIMX31LC multimedia
applications processors represent the next step in
low-power, high-performance application processors.
Unless otherwise specified, the material in this data sheet
is applicable to both the MCIMX31C and MCIMX31LC
processors and referred to singularly throughout this
document as MCIMX31C. The MCIMX31LC does not
include a graphics processing unit (GPU).
Based on an ARM11™ microprocessor core, the
MCIMX31C provides the performance with low power
consumption required by modern digital devices such
as:
• Automotive infotainment and navigation
• Industrial control (human interface)
The MCIMX31C takes advantage of the
ARM1136JF-S™ core running at 400 MHz, and is
optimized for minimal power consumption using the
most advanced techniques for power saving (DVFS,
power gating, clock gating). With 90 nm technology and
dual-Vt transistors (two threshold voltages), the
MCIMX31C and
MCIMX31LC
Multimedia Applications
Processors for Industrial and
Automotive Products
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Ordering Information . . . . . . . . . . . . . . . . . . . . . .3
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Functional Description and Application Information 4
ARM11 Microprocessor Core . . . . . . . . . . . . . . . .4
Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . .6
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . .9
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . .9
Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . .9
Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . .15
Module-Level Electrical Specifications . . . . . . . .16
Package Information and Pinout . . . . . . . . . . . . . .99
MAPBGA Production Package 473 19 x 19 mm,
0.8 mm Pitch . . . . . . . . . . . . . . . . . . . . . .100
Product Documentation . . . . . . . . . . . . . . . . . . . .106
Revision History . . . . . . . . . . . . . . . . . . . . . . . .107
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