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Freescale Semiconductor
Data Sheet, Technical Data
i.MX27 and i.MX27L
Package Information
Plastic Package
Case 1816-01
(MAPBGA–404)
Case 1931-04
(MAPBGA-473)
Ordering Information
See Ta ble 1 on page 4 for ordering information.
Document Number: MCIMX27EC
Rev. 1.7, 05/2011
© Freescale Semiconductor, Inc., 2011. All rights reserved.
1 Introduction
The i.MX27 and i.MX27L (MCIMX27/MX27L)
Multimedia Applications Processors represents the next
step in low-power, high-performance application
processors. Unless otherwise specified, the material in
this data sheet is applicable to both the i.MX27 and
i.MX27L processors and referred to singularly
throughout this document as i.MX27.
The i.MX27L does not include the following features:
ATA-6 HDD Interface, Memory Stick Pro, VPU:
MPEG-4/ H.263/H.264 HW encoder/decoder, and
eMMA (PrP processing, CSC, deblock, dering).
Based on an ARM926EJ-S™ microprocessor core, the
i.MX27/27L processor provides the performance with
low-power consumption required by modern digital
devices such as the following:
• Feature-rich cellular phones
• Portable media players and mobile gaming
machines
• Personal digital assistants (PDAs) and wireless
PDAs
i.MX27 and i.MX27L
Data Sheet
Multimedia Applications
Processor
Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3. Ordering Information . . . . . . . . . . . . . . . . . . . . . . 4
2. Functional Description and Application Information . . . . 4
2.1. ARM926 Microprocessor Core Platform . . . . . . . . 4
2.2. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3. Module Descriptions . . . . . . . . . . . . . . . . . . . . . . . 9
3. Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.1. Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . 35
3.2. EMI Pins Multiplexing . . . . . . . . . . . . . . . . . . . . . 35
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . 40
4.1. i.MX27/iMX27L Chip-Level Conditions . . . . . . . . 40
4.2. Module-Level Electrical Specifications . . . . . . . . 43
4.3. Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . 54
5. Package Information and Pinout . . . . . . . . . . . . . . . . 109
5.1. Full Package Outline Drawing (17 mm × 17 mm) 109
5.2. Pin Assignments (17 mm × 17 mm) . . . . . . . . . 110
5.3. Full Package Outline Drawing (19 mm × 19 mm) 129
5.4. Pin Assignments (19 mm × 19 mm) . . . . . . . . . 130
6. Product Documentation . . . . . . . . . . . . . . . . . . . . . . . 150
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
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