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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX25AEC
Rev. 10, 06/2013
MCIMX25
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
© 2009-2013 Freescale Semiconductor, Inc. All rights reserved.
1 Introduction
The i.MX25 family of processors are designed to
meet the connectivity requirements of today’s
automobile infotainment systems. To meet these
requirements, the i.MX25 processors provide
high-end features, such as CAN, USB connectivity,
and audio connectivity at a price point that is
suitable for all vehicles.
At the core of the i.MX25 is Freescale's fast,
proven, power-efficient implementation of the
ARM
®
926EJ-S™ core, with speeds of up to
400 MHz. The i.MX25 includes support for up to
133 MHz DDR2 memory, integrated 10/100
Ethernet MAC, and two on-chip USB PHYs. The
automotive versions of the i.MX25 offer
AEC-Q100 grade 3 qualification to meet stringent
automotive quality requirements. The device is
suitable for a wide range of applications, including
the following:
• USB Connectivity for media
storage/playback, personal media device
interface, and firmware updates
i.MX25 Applications
Processor for
Automotive Products
Silicon Version 1.2
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11
3.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18
3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 20
3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20
3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 24
3.7. Module Timing and Electrical Parameters . . . . . . 41
4. Package Information and Contact Assignment . . . . . . 124
4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124
4.2. Ground, Power, Sense, and Reference Contact
Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125
4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 135
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
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