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Freescale Semiconductor
Data Sheet: Advance Information
Document Number: IMX53AEC
Rev. 4, 11/2011
MCIMX53xA
Package Information
Plastic Package
Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 3
© 2011 Freescale Semiconductor, Inc. All rights reserved.
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
1 Introduction
The MCIMX53xA (i.MX53xA) automotive
infotainment processor is Freescale Semiconductor’s
latest addition to a growing family of
multimedia-focused products offering high performance
processing with a high degree of functional integration
aimed at the growing automotive infotainment,
telematics, HMI, and display-based cluster markets. This
device includes 3D and 2D graphics processors, 1080i/p
video processing, and dual display, and provides a
variety of interfaces.
The i.MX53xA processor features Freescale’s advanced
implementation of the ARM™ core, which operates at
clock speeds as high as 800 MHz and interfaces with
DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800
DRAM memories. This device is well suited for graphics
rendering for HMI, navigation, high performance speech
processing with large databases, video processing and
display, audio playback, and many other applications.
The flexibility of the i.MX53xA architecture allows for
its use in a wide variety of applications. As the heart of
the application chipset, the i.MX53xA processor
i.MX53xA Automotive and
Infotainment Applications
Processors
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17
4.2. Power Supply Requirements and Restrictions . . . 24
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 28
4.4. Output Buffer Impedance Characteristics . . . . . . 34
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38
4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 45
4.7. External Peripheral Interfaces Parameters . . . . . . 67
4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 146
5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 147
5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 147
5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 148
5.3. Power Setup During Boot . . . . . . . . . . . . . . . . . . 149
6. Package Information and Contact Assignments . . . . . 150
6.1. 19x19 mm Package Information . . . . . . . . . . . . . 150
6.2. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 169
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
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