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MC33886DHTAD
Rev 2.0, 7/2005
Freescale Semiconductor
Technical Data
© Freescale Semiconductor, Inc., 2005. All rights reserved.
5.0 A H-Bridge
THERMAL ADDENDUM
Introduction
This thermal addendum is provided as a supplement to the
MC33886 technical data sheet. The addendum provides thermal
performance information that may be critical in the design and
development of system applications. All electrical, application, and
packaging information is provided in the data sheet.
Packaging and Thermal Considerations
The MC33886 is offered in a 20 terminal HSOP exposed pad,
single die package. There is a single heat source (P), a single junction
temperature (T
J
), and thermal resistance (R
θJA
).
The stated values are solely for a thermal performance comparison
of one package to another in a standardized environment. This
methodology is not meant to and will not predict the performance of a
package in an application-specific environment. Stated values were
obtained by measurement and simulation according to the standards
listed below.
Standards
NOTES:
1.Per JEDEC JESD51-2 at natural convection, still air condition.
2.2s2p thermal test board per JEDEC JESD51-5 and JESD51-7.
3.Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
4.Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5.Thermal resistance between the die junction and the exposed
pad surface; cold plate attached to the package bottom side,
remaining surfaces insulated.
Figure 1. Thermal Land Pattern for Direct Thermal
Attachment According to JESD51-5
20-TERMINAL
HSOP-EP
33886DH
Note For package dimensions, refer to
the 33886 device datasheet.
DH SUFFIX
VW (Pb-FREE) SUFFIX
98ASH70702A
20-TERMINAL HSOP-EP
T
J
=
R
θJA
.
P
Table 1. Thermal Performance Comparison
Thermal Resistance [°C/W]
R
θJA
(1)(2)
20
R
θJB
(2)(3)
6.0
R
θJA
(1)(4)
52
R
θJC
(5)
1.0
1.0
1.0
0.2
0.2
Soldermast
openings
Thermal vias
connected to top
buried plane
* All measurements
are in millimeters
20 Terminal HSOP-EP
1.27 mm Pitch
16.0 mm x 11.0 mm Body
12.2 mm x 6.9 mm Exposed Pad
