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© Freescale Semiconductor, Inc., 2005. All rights reserved.
Freescale Semiconductor
Application Note
AN2388
Rev. 1.0, 12/2005
1.0 Purpose
This document is intended to provide information on
Heatsink Small Outline Package (HSOP) and it’s
process. The package related information includes:
Component and board level reliability, electrical
parasitic and thermal resistance data.
2.0 Scope
This application note is written generically, and
device specific information is not provided. This
document serves only as a guideline to help
develop user-specific solutions. Actual experience
and development efforts are still required to
optimize the process per individual device
requirements and practices.
Heatsink Small Outline Package (HSOP)
Contents
1.0 Purpose. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.0 Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3.0 HSOP Package Information. . . . . . . . . . . . 2
3.1 Package Description . . . . . . . . . . . . . . . . . 2
3.2 Package Dimensions . . . . . . . . . . . . . . . . . 2
4.0 Package Configuration . . . . . . . . . . . . . . . 4
4.1 Process Flow . . . . . . . . . . . . . . . . . . . . . . . 4
5.0 1st Level Reliability . . . . . . . . . . . . . . . . . . 4
6.0 2nd Level Reliability. . . . . . . . . . . . . . . . . . 5
7.0 Printed Circuit Board (PCB) Layout
Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.0 Package Thermal Resistances . . . . . . . . . 6
9.0 Electrical Performance . . . . . . . . . . . . . . . 7
10.0 Reference . . . . . . . . . . . . . . . . . . . . . . . . . . 9
