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Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 4
1 Publication Order Number:
MBT3906DW1T1/D
MBT3906DW1T1G,
SMBT3906DW1T1G
Dual General Purpose
Transistor
The MBT3906DW1T1G device is a spin−off of our popular
SOT−23/SOT−323 three−leaded device. It is designed for general
purpose amplifier applications and is housed in the SOT−363
six−leaded surface mount package. By putting two discrete devices in
one package, this device is ideal for low−power surface mount
applications where board space is at a premium.
Features
h
FE
, 100−300
Low V
CE(sat)
, 0.4 V
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
Available in 8 mm, 7−inch/3,000 Unit Tape and Reel
AEC−Q101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector−Emitter Voltage V
CEO
−40 Vdc
Collector−Base Voltage V
CBO
−40 Vdc
Emitter−Base Voltage V
EBO
−5.0 Vdc
Collector Current − Continuous I
C
−200 mAdc
Electrostatic Discharge ESD HBM Class 2
MM Class B
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Package Dissipation (Note 1)
T
A
= 25C
P
D
150 mW
Thermal Resistance,
Junction−to−Ambient
R
q
JA
833 C/W
Junction and Storage
Temperature Range
T
J
, T
stg
−55 to +150 C
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
recommended footprint.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping
†
ORDERING INFORMATION
SOT−363/SC−88
CASE 419B
STYLE 1
Q
1
(1)(2)
(3)
(4) (5) (6)
Q
2
MBT3906DW1T1G SOT−363
(Pb−Free)
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MARKING DIAGRAM
A2 = Device Code
M = Date Code
G = Pb−Free Package
A2 M G
G
1
6
http://onsemi.com
(Note: Microdot may be in either location)
SMBT3906DW1T1G SOT−363
(Pb−Free)
3,000 /
Tape & Reel
