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LT1371HVCR#PBF
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LT1371HVCR#PBF 应用笔记 - Linear Technology

更新时间: 2025-06-11 04:59:26 (UTC+8)

LT1371HVCR#PBF 应用笔记

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© Semiconductor Components Industries, LLC, 2013
April, 2013 Rev. 11
1 Publication Order Number:
MBRS340T3/D
MBRS320T3G, SBRS8320T3G,
MBRS330T3G, NRVBS330T3G,
MBRS340T3G, SBRS8340T3G
Surface Mount
Schottky Power Rectifier
These devices employ the Schottky Barrier principle in a large area
metal-to-silicon power diode. State-of-the-art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
Features
Small Compact Surface Mountable Package with J-Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
(0.5 V Max @ 3.0 A, T
J
= 25°C)
Excellent Ability to Withstand Reverse Avalanche Energy Transients
Guard-Ring for Stress Protection
Device Passes ISO 7637 Pulse #1
SBRS8 and NRVB Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AECQ101 Qualified and PPAP Capable
These are Pb-Free Packages*
Mechanical Characteristics
Case: Epoxy, Molded, Epoxy Meets UL 94 V0
Weight: 217 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Notch in Plastic Body Indicates Cathode Lead
Device Meets MSL 1 Requirements
ESD Ratings:
Machine Model = C (> 400 V)
Human Body Model = 3B (> 8000 V)
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping
ORDERING INFORMATION
SMC
CASE 403
PLASTIC
SCHOTTKY BARRIER
RECTIFIERS
3.0 AMPERES
20, 30, 40 VOLTS
MBRS320T3G SMC
(PbFree)
2,500 /
Tape & Reel
MARKING DIAGRAM
B3x = Device Code
x = 2, 3 or 4
A = Assembly Location
Y = Year
WW = Work Week
G = PbFree Package
http://onsemi.com
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
MBRS330T3G SMC
(PbFree)
2,500 /
Tape & Reel
MBRS340T3G SMC
(PbFree)
2,500 /
Tape & Reel
AYWW
B3xG
G
(Note: Microdot may be in either location)
SBRS8320T3G SMC
(PbFree)
2,500 /
Tape & Reel
NRVBS330T3G SMC
(PbFree)
2,500 /
Tape & Reel
SBRS8340T3G SMC
(PbFree)
2,500 /
Tape & Reel
页面指南

LT1371HVCR#PBF 数据手册 PDF

LT1371HVCR#PBF 数据手册
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LT1371HVCR#PBF 应用笔记
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