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SNAA214B LMZ1 and LMZ2 Power Module Design Summary Texas Instruments
Page 1 1/19/2016
Design Summary LMZ1xxx and
LMZ2xxx Power Module Family
Texas Instruments (TI) introduces
LMZ1xxx and LMZ2xxx Power Module
product family that is a comple
te power
supply solution in a leaded gullwing
style package outline. The NDW/NDY
packages meet the requirements set
forth in the European Union’s RoHS
and EU REACH legislation and are
suitable for industry-compliant Pb-
Free
soldering processes for shelf life and
maximum reflow temperature as
defined by JEDEC. The maximum
number of reflow is one. Each of the
packages has an exposed ground pad
that enhances thermal performance,
while using plastic encapsulant and
conventional copper lead frame
technology for a robust effective
solution. LMZxxx Power Modules are
available in different quantity reel sizes
following EIA-481 industry standard
Tape and Reel format.
www.ti.com
Illustration of 7-NDW Package
7-NDW 11-NDY
Total Number of Pins
7 11
Package Length (L) mm
13,77* 17,79*
Package Width (W) mm
10,16* 15,0*
Package Thickness (T) mm
4,67 Max 5,9*
Pitch mm*
1,27 1,27
Lead Finish
Matte Sn Matte Sn
RoHS Compliant
Yes Yes
Moisture Sensitivity Level
(JEDEC J-STD-020)
Level 3 /245°C Level 3 /245°C
* Dimensions Illustrated as Nominal Values
Operation Assembly Quick Start Checklist
Solder Paste
TI recommends the use of type 3 or finer solder paste when mounting the LMZ1xxx or
LMZ2xxx Power Module devices.
Reflow
Profile
Measure the peak reflow temperature by placing a fine gauge thermocouple (Type K)
on top of the package body center.
Ensure that the peak reflow temperature does not exceed 245°C max. (240°C ±5°C)
Exceeding the max temperature may damage the part.
Reflow time within 5°C Peak Temp must not exceed 20 seconds and the reflow time
above liquidus must not exceed 60 seconds.
The maximum number of reflow is one.
Moisture
Handling
LMZ1xxx and LMZ2xxx products are classified as MSL3 and require special handling
due to moisture sensitivity. MSL3 parts have a max floor life of 168 hours.
Parts must be reflowed prior to the 168-hour floor life after removing from the moisture
barrier bag. Parts must be baked out per JEDEC recommendations once the 168-hour
floor life has been exceeded. See Moisture Sensitivity Guidelines section for details.
