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Date:
19 Jul 2016
Product
Category:
16-bit Microcontrollers and Digital Signal Controllers;
8-bit Microcontrollers
Notification
subject:
CCB 2697 Initial Notice: Qualification of CuPdAu bond
wire in selected products of the 150K and 160K wafer
technologies available in 44L QFN (8x8x0.9mm) package
at MTAI assembly site.
Notification
text:
PCN Status:
Initial notification
Microchip Parts Affected:
Please open the attachments found in the attachments field
below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical
files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash
(CuPdAu) bond wire in selected products of the 150K and
160K wafer technologies available in 44L QFN
(8x8x0.9mm) package at MTAI assembly site.
Pre Change:
Using gold (Au) bond wire
Post Change:
Using gold (Au) bond wire or palladium coated copper with
gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Product Change Notification - JAON-14OICS710
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Product Change Notification
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JAON
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14OICS710
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19 Jul 2016
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CCB 2697 Initial Notic
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7/
20/
2016
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON
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14OICS710
