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©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Ceramic Surface Mount
C 0805 C 103 K 5 R A C*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
D – ±0.5pF M – ±20%
F – ±1% P – (GMV) – special order only
G – ±2% Z – +80%, -20%
DIMENSIONS—MILLIMETERS AND (INCHES)
CAPACITOR ORDERING
INFORMATION
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
• Tape and reel packaging per EIA481-1. (See page
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
• RoHS Compliant
FEATURES
CAPACITOR OUTLINE DRAWINGS
END METALLIZATION
C-Standard (Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P– X5R (±15%) (-55°C + 85°C)
U – Z5U (+22%, -56%) (+10°C + 85°C)
V – Y5V (+22%, -82%) (-30°C + 85°C)
VOLTAGE
1 - 100V 3 - 25V
2 - 200V 4 - 16V
5 - 50V 8 - 10V
W
L
T
B
S
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
ELECTRODES
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)
(Standard Chips - For
Military see page 87)
9 - 6.3V
7 - 4V
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
+ For extended value 1210 case size - solder reflow only.
72
1 - 100V 3 - 25V
2 - 200V 4 - 16V
5 - 50V 8 - 10V
6 - 35V 9 - 6.3V
7 - 4V
EIA SIZE
CODE
METRIC
SIZE CODE
L - LENGTH W - WIDTH
T
THICKNESS
B - BANDWIDTH
S
SEPARATION
minimum
MOUNTING
TECHNIQUE
0201* 0603 0.6 (.024) ± .03 (.001) 0.3 ± (.012) ± .03 (.001) 0.15 (.006) ± .05 (.002) N/A
0402* 1005 1.0 (.04) ± .05 (.002) 0.5 (.02) ± .05 (.002) 0.20 (.008) -.40 (.016) 0.3 (.012)
0603 1608 1.6 (.063) ± .15 (.006) 0.8 (.032) ± .15 (.006) 0.35 (.014) ± .15 (.006) 0.7 (.028)
0805* 2012 2.0 (.079) ± .20 (.008) 1.25 (.049) ± .20 (.008) 0.50 (.02) ± .25 (.010) 0.75 (.030)
1206* 3216 3.2 (.126) ± .20 (.008) 1.6 (.063) ± .20 (.008) 0.50 (.02) ± .25 (.010) N/A
1210* 3225 3.2 (.126) ± .20 (.008) 2.5 (.098) ± .20 (.008) 0.50 (.02) ± .25 (.010) N/A
1808 4520 4.5 (.177) ± .30 (.012) 2.0 (.079) ± .20 (.008) 0.60 (.024) ± .35 (.014) N/A
1812 4532 4.5 (.177) ± .30 (.012) 3.2 (.126) ± .30 (.012) 0.60 (.024) ± .35 (.014) N/A
1825* 4564 4.5 (.177) ± .30 (.012) 6.4 (.252) ± .40 (.016) 0.60 (.024) ± .35 (.014) N/A
2220 5650 5.6 (.220) ± .40 (.016) 5.0 (.197) ± .40 (.016) 0.60 (.024) ± .35 (.014) N/A
2225 5664 5.6 (.220) ± .40 (.016) 6.3 (.248) ± .40 (.016) 0.60 (.024) ± .35 (.014) N/A
Solder Wave +
or
Solder Reflow
See page 78
for thickness
dimensions.
Solder Reflow
Solder Reflow
