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AM3351BZCEA60 应用笔记 - TI

  • 制造商:
    TI
  • 分类:
    微处理器
  • 封装
    LFBGA-298
  • 描述:
    MPU AM335x RISC 32Bit 600MHz 1.8V/3.3V Automotive 298Pin NFBGA Tray
更新时间: 2025-06-09 15:56:58 (UTC+8)

AM3351BZCEA60 应用笔记

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Wiki Article
SPRABT1April 2013
AM335x Thermal Considerations
..................................................................................................................... ARM MPU Applications
ABSTRACT
This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of
the processor's thermal performance, suggests improvements for an end system to aid in overcoming
some of the existing challenges of producing a good thermal design, and provides real power/thermal data
measured with AM335x EVMs for user evaluation.
This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to
contribute, visit this topic at:
http://processors.wiki.ti.com/index.php/AM335x_Thermal_Considerations.
All trademarks are property of their respective owners.
1
SPRABT1April 2013 AM335x Thermal Considerations
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Copyright © 2013, Texas Instruments Incorporated

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